Invention Grant
US09214353B2 Systems and methods for laser splitting and device layer transfer
有权
用于激光分裂和器件层转移的系统和方法
- Patent Title: Systems and methods for laser splitting and device layer transfer
- Patent Title (中): 用于激光分裂和器件层转移的系统和方法
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Application No.: US13778047Application Date: 2013-02-26
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Publication No.: US09214353B2Publication Date: 2015-12-15
- Inventor: Takao Yonehara , Virenda V. Rana , Sean Seutter , Mehrdad M. Moslehi , Subramanian Tamilmani
- Applicant: Solexel, Inc.
- Applicant Address: US CA Milpitas
- Assignee: Solexel, Inc.
- Current Assignee: Solexel, Inc.
- Current Assignee Address: US CA Milpitas
- Agent John Wood
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L21/304 ; H01L21/268 ; H01L31/18 ; B23K26/00 ; B23K26/06 ; B23K26/08 ; B23K26/30 ; H01L33/00 ; H01L25/065
Abstract:
Methods and systems are provided for the split and separation of a layer of desired thickness of crystalline semiconductor material containing optical, photovoltaic, electronic, micro-electro-mechanical system (MEMS), or optoelectronic devices, from a thicker donor wafer using laser irradiation.
Public/Granted literature
- US20140038392A1 SYSTEMS AND METHODS FOR LASER SPLITTING AND DEVICE LAYER TRANSFER Public/Granted day:2014-02-06
Information query
IPC分类:
