发明授权
- 专利标题： Semiconductor die package with pre-molded die
- 专利标题（中）： 具有预成型模具的半导体模具封装
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申请号： US14551069申请日： 2014-11-23
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公开(公告)号： US09214413B2公开(公告)日： 2015-12-15
- 发明人: Zhijie Wang , Zhigang Bai , Aipeng Shu , Yanbo Xu , Huchang Zhang , Fei Zong
- 申请人： Zhijie Wang , Zhigang Bai , Aipeng Shu , Yanbo Xu , Huchang Zhang , Fei Zong
- 申请人地址： US TX Austin
- 专利权人： FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人： FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人地址： US TX Austin
- 代理商 Charles Bergere
- 优先权： CN201410137252 20140225
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L23/495 ; H01L21/56 ; H01L23/373 ; H01L23/42
摘要：
A semiconductor die is packaged by providing a die assembly that includes a semiconductor die with an active surface and an opposite mounting surface with an attached thermally conductive substrate. The die assembly is mounted on a first surface of a lead frame die flag so that the thermally conductive substrate is sandwiched between the die flag and the semiconductor die. Bonding pads of the die are electrically connected with bond wires to lead frame lead fingers. A mold compound then encapsulates the semiconductor die, bond wires, and thermally conductive substrate. A second surface of the die flag is exposed through the mold compound.
公开/授权文献
- US20150243586A1 SEMICONDUCTOR DIE PACKAGE WITH PRE-MOLDED DIE 公开/授权日：2015-08-27
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