发明授权
- 专利标题： Electronic component module
- 专利标题（中）： 电子元件模块
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申请号： US13589446申请日： 2012-08-20
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公开(公告)号： US09214617B2公开(公告)日： 2015-12-15
- 发明人: Hiromasa Kato , Takayuki Naba , Noritaka Nakayama
- 申请人： Hiromasa Kato , Takayuki Naba , Noritaka Nakayama
- 申请人地址： JP Tokyo JP Yokohama-Shi
- 专利权人： KABUSHIKI KAISHA TOSHIBA,TOSHIBA MATERIALS CO., LTD.
- 当前专利权人： KABUSHIKI KAISHA TOSHIBA,TOSHIBA MATERIALS CO., LTD.
- 当前专利权人地址： JP Tokyo JP Yokohama-Shi
- 代理机构： Foley & Lardner LLP
- 优先权： JP2006-062706 20060308
- 主分类号： H05K1/16
- IPC分类号： H05K1/16 ; H05K1/18 ; H05K1/02 ; H01L35/30 ; H01L23/373 ; H01L23/00 ; H05K3/34
摘要：
An electronic component module has a circuit board in which metal plates are bonded to both surfaces of a ceramic substrate, and an electronic component that is bonded to at least one surface of the metal plate and is operable at least 125° C. The electronic component is bonded to the metal plate via a brazing material layer having a higher melting point than a operating temperature of the electronic component.
公开/授权文献
- US20120305304A1 ELECTRONIC COMPONENT MODULE 公开/授权日：2012-12-06
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