Invention Grant
- Patent Title: Compound structure and method for forming a compound structure
- Patent Title (中): 用于形成复合结构的复合结构和方法
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Application No.: US14105414Application Date: 2013-12-13
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Publication No.: US09219049B2Publication Date: 2015-12-22
- Inventor: Rudolf Berger , Guenther Ruhl , Wolfgang Lehnert , Roland Rupp
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/48 ; H01L21/46 ; H01L23/00
Abstract:
A compound structure including a carrier wafer and at least one semiconductor piece bonded onto the carrier wafer by a bonding material obtained by a ceramic-forming polymer precursor.
Public/Granted literature
- US20150171045A1 Compound Structure and Method for Forming a Compound Structure Public/Granted day:2015-06-18
Information query
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