Invention Grant
- Patent Title: Method for producing optoelectronic semiconductor components, leadframe assemblage and optoelectronic semiconductor component
- Patent Title (中): 光电子半导体元件制造方法，引线框组合和光电半导体元件
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Application No.: US14363738Application Date: 2012-12-13
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Publication No.: US09219210B2Publication Date: 2015-12-22
- Inventor: Michael Zitzlsperger , Jürgen Holz
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Slater & Matsil, L.L.P.
- Priority: DE102011056700 20111220
- International Application: PCT/EP2012/075431 WO 20121213
- International Announcement: WO2013/092387 WO 20130627
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L33/62 ; H01L31/0203 ; H01L23/00 ; H01L25/13 ; H01L33/52 ; G01R31/26 ; H01L33/00 ; H01L33/48 ; H01L23/495
Abstract:
A method serves to produce optoelectronic semiconductor components. A leadframe assemblage includes a number of leadframes. The leadframes each comprise at least two leadframe parts and are connected together at least in part via connecting webs. Electrical connections are attached between neighboring leadframes. A potting body connects the leadframes and the leadframe parts mechanically together. At least some of the connecting webs are removed and/or interrupted, the resulting structure is singulated into the semiconductor components.
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