Invention Grant
US09224712B2 3D bond and assembly process for severely bowed interposer die
有权
用于严重弯曲插入物模具的3D结合和组装过程
- Patent Title: 3D bond and assembly process for severely bowed interposer die
- Patent Title (中): 用于严重弯曲插入物模具的3D结合和组装过程
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Application No.: US14177348Application Date: 2014-02-11
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Publication No.: US09224712B2Publication Date: 2015-12-29
- Inventor: Marcus E. Interrante , Mario J. Interrante , Katsuyuki Sakuma
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Steven J. Meyers, Esq.
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L23/00 ; H01L21/56 ; H01L23/498 ; H01L25/00 ; H01L25/065 ; H01L21/683 ; B23K3/06
Abstract:
An interposer structure containing a first set of solder balls is placed in proximity to a vacuum distribution plate which has a planar contact surface and a plurality of openings located therein. A vacuum is then applied through the openings within the vacuum distribution plate such that the first set of solder balls are suspended within the plurality of openings and the interposer structure conforms to the planar contact surface of the vacuum distribution plate. A semiconductor chip containing a second set of solder balls is tacked to a surface of the interposer structure. A substrate is then brought into contact with a surface of the interposer structure containing the first set of solder balls, and then a solder reflow and underfill processes can be performed. Warping of the interposer structure is substantially eliminated using the vacuum distribution plate mentioned above.
Public/Granted literature
- US20150228614A1 3D BOND AND ASSEMBLY PROCESS FOR SEVERELY BOWED INTERPOSER DIE Public/Granted day:2015-08-13
Information query
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