Invention Grant
US09224783B2 Plasma densification of dielectrics for improved dielectric loss tangent
有权
电介质的等离子体致密化以改善介质损耗角正切
- Patent Title: Plasma densification of dielectrics for improved dielectric loss tangent
- Patent Title (中): 电介质的等离子体致密化以改善介质损耗角正切
-
Application No.: US14139222Application Date: 2013-12-23
-
Publication No.: US09224783B2Publication Date: 2015-12-29
- Inventor: Frank Greer , Andy Steinbach , Wenxian Zhu
- Applicant: Intermolecular Inc.
- Applicant Address: US CA San Jose
- Assignee: Intermolecular, Inc.
- Current Assignee: Intermolecular, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/469 ; H01L27/18 ; H01L39/24

Abstract:
Defects in hydrogenated amorphous silicon are reduced by low-energy ion treatments and optional annealing. The treatments leave strongly-bonded hydrogen and other passivants in place, but increase the mobility of loosely-bonded and interstitially trapped hydrogen that would otherwise form unwanted two-level systems (TLS). The mobilized hydrogen atoms may be attracted to unused passivation sites or recombined into H2 gas and diffuse out of the deposited layer. The treatments also increase the density of the material. The optional anneal may partially crystallize the layer, further densify the layer, or both. The reduced number of defects and the increased crystallinity reduce the loss tangent of amorphous silicon dielectrics for superconducting microwave devices.
Public/Granted literature
- US20150179436A1 Plasma densification of dielectrics for improved dielectric loss tangent Public/Granted day:2015-06-25
Information query
IPC分类: