In various examples, a neurostimulation interconnection apparatus apparatus includes a substrate disposed within a header of a neurostimulation device. A spring contact is mounted to the substrate. The spring contact is oriented to accept and apply a clamping force to a proximal contact of a lead body to electrically couple the proximal contact of the lead body with the spring contact with insertion of the proximal contact within the spring contact. A trace is disposed on the substrate from the spring contact to a pin of a feedthrough of the neurostimulation device. The trace electrically couples the spring contact with the pin of the feedthrough.