Invention Grant
- Patent Title: Laser subassembly metallization for heat assisted magnetic recording
- Patent Title (中): 用于热辅助磁记录的激光组件金属化
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Application No.: US13797839Application Date: 2013-03-12
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Publication No.: US09227257B2Publication Date: 2016-01-05
- Inventor: Jon Paul Hurley , Bernard W. Bell, Jr. , Steven Harlow Anderson Axdal
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee Address: US CA Cupertino
- Agency: Hollingsworth Davis, LLC
- Main IPC: H01S5/02
- IPC: H01S5/02 ; B23K1/00 ; G11B13/04 ; H01L23/488 ; G11B5/105 ; B23K35/24 ; H01L21/60 ; G11B5/00

Abstract:
A heat assisted magnetic recording (HAMR) assembly includes a slider, a laser diode and solder connections between the laser diode and the slider. The solder connections mechanically and electrically attach the laser diode to the slider. Each solder connection has a total volume per unit area (i.e., height) of less than or equal to about 15 μm. The solder connections have a first intermetallic zone adjacent to the laser diode, a second intermetallic zone adjacent to the slider, and a eutectic zone of eutectic material between the first and second intermetallic zones. The eutectic zone occupies greater than or equal to about 35% of the total volume per unit area of the solder connection.
Public/Granted literature
- US20130279311A1 LASER SUBASSEMBLY METALLIZATION FOR HEAT ASSISTED MAGNETIC RECORDING Public/Granted day:2013-10-24
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