Invention Grant
- Patent Title: Butt-coupled buried waveguide photodetector
- Patent Title (中): 对接耦合埋地波导光电探测器
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Application No.: US13868477Application Date: 2013-04-23
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Publication No.: US09229164B2Publication Date: 2016-01-05
- Inventor: Solomon Assefa , William M. Green , Steven M. Shank , Yurii A. Vlasov
- Applicant: International Business Machines Corporation
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Michael LeStrange; Andrew M. Calderon
- Main IPC: H01L31/18
- IPC: H01L31/18 ; H01L31/08 ; H01L31/0232 ; G02B6/13 ; G02B6/12 ; G02B6/132

Abstract:
A method of forming an integrated photonic semiconductor structure having a photodetector and a CMOS device may include forming the CMOS device on a first silicon-on-insulator region, forming a silicon optical waveguide on a second silicon-on-insulator region, and forming a shallow trench isolation (STI) region surrounding the silicon optical waveguide such that the shallow trench isolation electrically isolates the first and second silicon-on-insulator region. Within the STI region, a germanium material is deposited adjacent an end facet of the semiconductor optical waveguide. The germanium material forms an active region that receives propagating optical signals from the end facet of the semiconductor optical waveguide.
Public/Granted literature
- US20140312443A1 BUTT-COUPLED BURIED WAVEGUIDE PHOTODETECTOR Public/Granted day:2014-10-23
Information query
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