Invention Grant
- Patent Title: Chip thermistor
- Patent Title (中): 片式热敏电阻
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Application No.: US14061238Application Date: 2013-10-23
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Publication No.: US09230718B2Publication Date: 2016-01-05
- Inventor: Daisuke Tsuchida , Yo Saito , Kouki Yamada
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2012-244643 20121106
- Main IPC: H01C7/10
- IPC: H01C7/10 ; H01C7/00 ; H01C1/148 ; H01C17/28 ; H01C17/00 ; H01G4/232

Abstract:
A chip thermistor includes a thermistor element body and a pair of outer electrodes. The thermistor element body has a pair of end faces opposing each other and a main face connecting the end faces to each other. The pair of outer electrodes are arranged on the pair of end faces, respectively. The pair of outer electrodes have a width in a direction intersecting the opposing direction of the pair of end faces made narrower with distance from the thermistor element body.
Public/Granted literature
- US20140125448A1 CHIP THERMISTOR Public/Granted day:2014-05-08
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