Invention Grant
- Patent Title: Stack type semiconductor package
- Patent Title (中): 堆叠型半导体封装
-
Application No.: US14267259Application Date: 2014-05-01
-
Publication No.: US09230876B2Publication Date: 2016-01-05
- Inventor: Jang-Woo Lee , Jong-Bo Shim , Kyoung-sei Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2013-0070474 20130619
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/36 ; H01L23/00 ; H01L25/10 ; H01L25/00 ; H01L23/538 ; H01L23/367 ; H01L23/373

Abstract:
A stack type semiconductor package includes: a lower semiconductor package including a lower package substrate, and a lower semiconductor chip which is mounted on the lower package substrate and includes a first surface facing a top surface of the lower package substrate and a second surface opposite to the first surface; an upper semiconductor package including an upper package substrate and an upper semiconductor chip which is mounted on the upper package substrate; an inter-package connection unit which connects the lower package substrate and the upper package substrate; a heat dissipation member which is formed on the second surface of the lower semiconductor chip; and an interconnection unit which is formed on a bottom surface of the upper package substrate, and is adhered to the heat dissipation member to connect the lower semiconductor chip and the upper package substrate.
Public/Granted literature
- US20140374902A1 STACK TYPE SEMICONDUCTOR PACKAGE Public/Granted day:2014-12-25
Information query
IPC分类: