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公开(公告)号：USD754700S1
公开(公告)日：2016-04-26
申请号：US29484983
申请日：2014-03-14
设计人： Jang-Woo Lee , Yong-Ho Kim , Jung-Kun Lee
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公开(公告)号：USD755216S1
公开(公告)日：2016-05-03
申请号：US29481712
申请日：2014-02-10
设计人： Jang-Woo Lee , Jung-Kun Lee , Yong-Ho Kim
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公开(公告)号：US09230876B2
公开(公告)日：2016-01-05
申请号：US14267259
申请日：2014-05-01
发明人： Jang-Woo Lee , Jong-Bo Shim , Kyoung-sei Choi
IPC分类号： H01L23/48 , H01L23/36 , H01L23/00 , H01L25/10 , H01L25/00 , H01L23/538 , H01L23/367 , H01L23/373
CPC分类号： H01L23/36 , H01L23/367 , H01L23/3736 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/105 , H01L25/50 , H01L2224/03312 , H01L2224/0346 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05573 , H01L2224/05578 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/131 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2224/16225 , H01L2224/1703 , H01L2224/17181 , H01L2224/17519 , H01L2224/32225 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45169 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/81191 , H01L2224/81192 , H01L2224/94 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/00014 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/00012 , H01L2224/11 , H01L2924/014 , H01L2224/03 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A stack type semiconductor package includes: a lower semiconductor package including a lower package substrate, and a lower semiconductor chip which is mounted on the lower package substrate and includes a first surface facing a top surface of the lower package substrate and a second surface opposite to the first surface; an upper semiconductor package including an upper package substrate and an upper semiconductor chip which is mounted on the upper package substrate; an inter-package connection unit which connects the lower package substrate and the upper package substrate; a heat dissipation member which is formed on the second surface of the lower semiconductor chip; and an interconnection unit which is formed on a bottom surface of the upper package substrate, and is adhered to the heat dissipation member to connect the lower semiconductor chip and the upper package substrate.
摘要翻译： 堆叠型半导体封装包括：下半导体封装，包括下封装衬底，以及下半导体芯片，其安装在下封装衬底上，并且包括面向下封装衬底的顶表面的第一表面和与下封装衬底相对的第二表面 第一面; 上半导体封装，包括上封装基板和安装在上封装基板上的上半导体芯片; 连接下封装基板和上封装基板的封装间连接单元; 形成在下半导体芯片的第二表面上的散热构件; 以及互连单元，其形成在所述上封装基板的底表面上，并且粘附到所述散热构件以连接所述下半导体芯片和所述上封装基板。
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公开(公告)号：US10545628B2
公开(公告)日：2020-01-28
申请号：US14817290
申请日：2015-08-04
发明人： Jong-hyun Ryu , Yong-gook Park , Jang-Woo Lee , Jae-young Lee , Jae-ho Jung , Yang-wook Kim
IPC分类号： G06F3/048 , G06F3/0481 , G06F8/61
摘要： A device for managing applications installed on the device and a method thereof are provided. The device includes a controller configured to obtain driving information of the applications in response to the applications being executed, and determine an application satisfying an uninstall condition, among the applications, based on the driving information. The device further includes an interface configured to change a display of an object indicating the determined application, based on the uninstall condition.
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公开(公告)号：USD755215S1
公开(公告)日：2016-05-03
申请号：US29481710
申请日：2014-02-10
设计人： Jung-Kun Lee , Jang-Woo Lee , Yong-Ho Kim
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