Provided is a semiconductor package including a package substrate having lands, a first semiconductor device mounted on the package substrate and having a bottom surface on which first lines are disposed, and solder balls respectively electrically connected to the lands of the package substrate with the first lines of the first semiconductor device. The first semiconductor device includes a first substrate, and through-substrate via (TSV) plugs that vertically pass through the first substrate. The TSV plugs are respectively vertically aligned with the first lines, overlap first regions corresponding to 70% or less of diameters of the solder balls from central axes of the solder balls, and do not overlap second regions corresponding to the remaining 30% or more of diameters of the solder balls from the central axes of the solder balls. Adjacent ones of the TSV plugs are arranged at irregular intervals with respect to each other.