Invention Grant
- Patent Title: Molybdenum compound powder, prepreg, and laminate
- Patent Title (中): 钼化合物粉末，预浸料和层压板
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Application No.: US14347075Application Date: 2012-09-12
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Publication No.: US09232648B2Publication Date: 2016-01-05
- Inventor: Tetsuro Miyahira , Yoshihiro Kato , Takaaki Ogashiwa , Hiroshi Takahashi
- Applicant: Tetsuro Miyahira , Yoshihiro Kato , Takaaki Ogashiwa , Hiroshi Takahashi
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2011-208981 20110926
- International Application: PCT/JP2012/073313 WO 20120912
- International Announcement: WO2013/047203 WO 20130404
- Main IPC: B32B3/02
- IPC: B32B3/02 ; H05K1/03 ; C01G39/00 ; C01G39/02 ; C08J5/24 ; C08K9/02 ; C08L63/00 ; C09C1/00 ; C08L71/12 ; B32B27/20
Abstract:
The present invention provides a novel surface-treated molybdenum compound powder and provides a prepreg, a laminate, a metal foil laminate, a printed wiring board, and the like that have a low thermal expansion coefficient in the planar direction, and excellent drillability, heat resistance, and flame retardancy. The surface-treated molybdenum compound powder of the present invention has at least part of the surface thereof coated with an inorganic oxide, and this is used as a filler.
Public/Granted literature
- US20140308489A1 MOLYBDENUM COMPOUND POWDER, PREPREG, AND LAMINATE Public/Granted day:2014-10-16
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