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公开(公告)号：US09955573B2
公开(公告)日：2018-04-24
申请号：US13980686
申请日：2012-01-18
IPC分类号： B32B27/38 , B32B15/08 , H05K1/03 , C08J5/24 , C08G59/40 , C08L63/00 , B32B5/02 , B32B5/26 , B32B5/28 , B32B15/14 , B32B15/20
CPC分类号： H05K1/0373 , B32B5/024 , B32B5/26 , B32B5/28 , B32B15/14 , B32B15/20 , B32B2250/05 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2307/206 , B32B2307/3065 , B32B2307/308 , B32B2307/734 , B32B2457/08 , C08G59/40 , C08J5/24 , C08K3/11 , C08L63/00 , H05K1/0366 , H05K2201/0209 , Y10T428/31529
摘要： It is an object to provide a prepreg for a printed laminate that has a low thermal expansion coefficient in the planar direction, excellent drillability, and further excellent heat resistance and flame retardancy, and a laminate and a metal foil-clad laminate. A resin composition according to the present invention includes a molybdenum compound (A); an epoxy resin (B); a curing agent (C); and an inorganic filler (D), wherein a Mohs hardness of the inorganic filler (D) is 3.5 or more, and a content of the inorganic filler (D) is 40 to 600 parts by mass based on 100 parts by mass of a total of resin solid components.
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公开(公告)号：US20130089743A1
公开(公告)日：2013-04-11
申请号：US13639351
申请日：2011-04-07
IPC分类号： C09D171/00 , C09D163/00 , C08K3/22 , C08L63/00 , C08L71/00
CPC分类号： H05K1/056 , C08G59/4042 , C08G59/621 , C08J5/24 , C08J2363/00 , C08K3/013 , C08K3/22 , C08K5/3415 , C08L63/00 , C08L71/00 , C09D163/00 , C09D171/00 , Y10T428/31529
摘要： There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.
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公开(公告)号：US20140308489A1
公开(公告)日：2014-10-16
申请号：US14347075
申请日：2012-09-12
CPC分类号： H05K1/0373 , B32B27/20 , C01G39/00 , C01G39/02 , C01P2004/61 , C01P2004/62 , C01P2004/84 , C08J5/24 , C08K3/22 , C08K9/02 , C08K2003/2255 , C08L63/00 , C08L71/12 , C09C1/0003 , H05K2201/0224 , Y10T428/24893 , Y10T428/256
摘要： The present invention provides a novel surface-treated molybdenum compound powder and provides a prepreg, a laminate, a metal foil laminate, a printed wiring board, and the like that have a low thermal expansion coefficient in the planar direction, and excellent drillability, heat resistance, and flame retardancy. The surface-treated molybdenum compound powder of the present invention has at least part of the surface thereof coated with an inorganic oxide, and this is used as a filler.
摘要翻译： 本发明提供了一种新型的表面处理的钼化合物粉末，并且提供了在平面方向上具有低热膨胀系数的预浸料，层压体，金属箔层压体，印刷线路板等，并且具有优异的可钻性，热 阻力和阻燃性。 本发明的经表面处理的钼化合物粉末的表面的至少一部分涂覆有无机氧化物，并将其用作填料。
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公开(公告)号：US20140017502A1
公开(公告)日：2014-01-16
申请号：US13980686
申请日：2012-01-18
IPC分类号： H05K1/03
CPC分类号： H05K1/0373 , B32B5/024 , B32B5/26 , B32B5/28 , B32B15/14 , B32B15/20 , B32B2250/05 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2307/206 , B32B2307/3065 , B32B2307/308 , B32B2307/734 , B32B2457/08 , C08G59/40 , C08J5/24 , C08K3/11 , C08L63/00 , H05K1/0366 , H05K2201/0209 , Y10T428/31529
摘要： It is an object to provide a prepreg for a printed laminate that has a low thermal expansion coefficient in the planar direction, excellent drillability, and further excellent heat resistance and flame retardancy, and a laminate and a metal foil-clad laminate. A resin composition according to the present invention includes a molybdenum compound (A); an epoxy resin (B); a curing agent (C); and an inorganic filler (D), wherein a Mohs hardness of the inorganic filler (D) is 3.5 or more, and a content of the inorganic filler (D) is 40 to 600 parts by mass based on 100 parts by mass of a total of resin solid components.
摘要翻译： 本发明的目的是提供一种在平面方向上具有低热膨胀系数，优异的可钻性和进一步优异的耐热性和阻燃性的印刷层压体的预浸料，以及叠层和覆金属箔层压板。 根据本发明的树脂组合物包括钼化合物（A）; 环氧树脂（B）; 固化剂（C）; 和无机填料（D）的无机填料（D），其中无机填料（D）的莫氏硬度为3.5以上，无机填料（D）的含量相对于总计100质量份为40〜600质量份 的树脂固体组分。
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公开(公告)号：US20130045650A1
公开(公告)日：2013-02-21
申请号：US13581926
申请日：2011-03-01
IPC分类号： C09D163/00 , C09D171/10 , C09D165/00 , B32B27/12 , B32B15/092
CPC分类号： B32B15/08 , B32B27/04 , B32B27/38 , B32B2457/00 , C08G59/245 , C08G59/4014 , C08G59/504 , C08G59/621 , C08J5/24 , C08J2363/00 , Y10T428/249921 , Y10T442/20
摘要： There is provided a resin composition that, despite the fact that the content of an inorganic filler is on approximately the same level as that of the conventional resins, can provide a cured resin product that has a low coefficient of thermal expansion in a plane direction and possesses excellent heat resistance and flame retardance. The resin composition comprises an epoxy resin (A), a maleimide compound (B), a curing agent (C), and an inorganic filler (D), the epoxy resin (A) being represented by formula (I):
摘要翻译： 提供了一种树脂组合物，尽管无机填料的含量与常规树脂的含量大致相同，但可以提供在平面方向上具有低热膨胀系数的固化树脂产品，以及 具有优异的耐热性和阻燃性。 该树脂组合物包含环氧树脂（A），马来酰亚胺化合物（B），固化剂（C）和无机填料（D），环氧树脂（A）由式（I）表示：
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公开(公告)号：US09480164B2
公开(公告)日：2016-10-25
申请号：US14122073
申请日：2012-05-29
IPC分类号： B32B27/38 , H05K3/00 , C08G73/06 , C08L79/04 , C08L79/08 , H05K1/03 , C08J5/24 , B32B5/02 , B32B15/14 , B32B15/20 , C08K5/3445 , C08K5/29 , C08K5/3415
CPC分类号： H05K3/0061 , B32B5/024 , B32B15/14 , B32B15/20 , B32B2255/02 , B32B2255/26 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2264/102 , B32B2307/51 , B32B2457/00 , C08G73/0655 , C08J5/24 , C08J2379/04 , C08J2379/08 , C08K3/013 , C08K5/29 , C08K5/315 , C08K5/3415 , C08K5/3445 , C08L63/00 , C08L79/04 , C08L79/085 , H05K1/0326 , H05K1/0346 , H05K2201/0209 , H05K2201/0355 , Y10T156/10 , Y10T428/31529 , C08K3/0033
摘要： It is an object of the present invention to provide, without using a halogenated compound or a phosphorus compound, a resin composition for printed wiring boards, a prepreg, a laminate, and a metal foil-clad laminate, each of which has high-degree flame retardance, has a low water absorption ratio and a high glass transition temperature, and has a high elastic modulus at high temperature.A resin composition according to the present invention includes a specific maleimide compound (A); a cyanate ester compound (B); a non-halogen epoxy resin (C); and an inorganic filler (D).
摘要翻译： 根据本发明的树脂组合物包括特定的马来酰亚胺化合物（A）; 氰酸酯化合物（B）; 非卤素环氧树脂（C）; 和无机填料（D）。
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公开(公告)号：US10212813B2
公开(公告)日：2019-02-19
申请号：US13639351
申请日：2011-04-07
IPC分类号： B32B27/08 , B32B27/38 , H05K1/05 , C08G59/40 , C08G59/62 , C08J5/24 , C09D163/00 , C08K3/22 , C08L63/00 , C08L71/00 , C09D171/00 , C08K5/3415 , C08K3/013
摘要： There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.
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公开(公告)号：US09232648B2
公开(公告)日：2016-01-05
申请号：US14347075
申请日：2012-09-12
IPC分类号： B32B3/02 , H05K1/03 , C01G39/00 , C01G39/02 , C08J5/24 , C08K9/02 , C08L63/00 , C09C1/00 , C08L71/12 , B32B27/20
CPC分类号： H05K1/0373 , B32B27/20 , C01G39/00 , C01G39/02 , C01P2004/61 , C01P2004/62 , C01P2004/84 , C08J5/24 , C08K3/22 , C08K9/02 , C08K2003/2255 , C08L63/00 , C08L71/12 , C09C1/0003 , H05K2201/0224 , Y10T428/24893 , Y10T428/256
摘要： The present invention provides a novel surface-treated molybdenum compound powder and provides a prepreg, a laminate, a metal foil laminate, a printed wiring board, and the like that have a low thermal expansion coefficient in the planar direction, and excellent drillability, heat resistance, and flame retardancy. The surface-treated molybdenum compound powder of the present invention has at least part of the surface thereof coated with an inorganic oxide, and this is used as a filler.
摘要翻译： 本发明提供了一种新型的表面处理的钼化合物粉末，并且提供了在平面方向上具有低热膨胀系数的预浸料，层压体，金属箔层压体，印刷线路板等，并且具有优异的可钻性，热 阻力和阻燃性。 本发明的经表面处理的钼化合物粉末的表面的至少一部分涂覆有无机氧化物，并将其用作填料。
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公开(公告)号：US20140227531A1
公开(公告)日：2014-08-14
申请号：US14122073
申请日：2012-05-29
CPC分类号： H05K3/0061 , B32B5/024 , B32B15/14 , B32B15/20 , B32B2255/02 , B32B2255/26 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2264/102 , B32B2307/51 , B32B2457/00 , C08G73/0655 , C08J5/24 , C08J2379/04 , C08J2379/08 , C08K3/013 , C08K5/29 , C08K5/315 , C08K5/3415 , C08K5/3445 , C08L63/00 , C08L79/04 , C08L79/085 , H05K1/0326 , H05K1/0346 , H05K2201/0209 , H05K2201/0355 , Y10T156/10 , Y10T428/31529 , C08K3/0033
摘要： It is an object of the present invention to provide, without using a halogenated compound or a phosphorus compound, a resin composition for printed wiring boards, a prepreg, a laminate, and a metal foil-clad laminate, each of which has high-degree flame retardance, has a low water absorption ratio and a high glass transition temperature, and has a high elastic modulus at high temperature. A resin composition according to the present invention includes a specific maleimide compound (A); a cyanate ester compound (B); a non-halogen epoxy resin (C); and an inorganic filler (D).
摘要翻译： 本发明的目的是提供一种不使用卤化物或磷化合物的印刷电路板用树脂组合物，预浸料坯，层压体和覆盖金属箔的层叠体，其中，高分子量 阻燃性，吸水率低，玻璃化转变温度高，高温弹性模量高。 根据本发明的树脂组合物包括特定的马来酰亚胺化合物（A）; 氰酸酯化合物（B）; 非卤素环氧树脂（C）; 和无机填料（D）。
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公开(公告)号：US20130136930A1
公开(公告)日：2013-05-30
申请号：US13816008
申请日：2011-08-29
IPC分类号： C08K3/00
CPC分类号： C08J5/24 , B32B5/26 , B32B15/092 , B32B15/14 , B32B2262/10 , B32B2307/3065 , B32B2307/58 , B32B2307/734 , B32B2457/08 , C08J2363/00 , C08J2363/04 , C08K3/105 , C08K3/26 , C08K2003/267 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , Y10T428/31529 , C08L63/00
摘要： There are provided a resin composition for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance, a prepreg prepared using the resin composition, and a laminated sheet and a metal foil-laminated sheet prepared using the prepreg. The resin composition comprises (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by formula (1): xMgCO3.yMg(OH)2.zH2O (1) wherein x:y:z is 4:1:4, 4:1:5, 4:1:6, 4:1:7, 3:1:3, or 3:1:4 and huntite; (B) an epoxy resin; and (C) a curing agent.
摘要翻译： 提供了一种在平面方向上具有低热膨胀系数的印刷电路板用树脂组合物，具有优异的耐热性和钻孔加工性，并且同时可以保持高水平的阻燃性，制备预浸料 使用该树脂组合物，以及层压片和使用该预浸料制备的金属箔层压片。 树脂组合物包含（A）无机填料，其是由式（1）表示的氢化镁石组成的混合物：xMgCO 3 y Mg（OH）2·zH 2 O（1）其中x：y：z为4：1：4， 4：1：5,4：1：6,4：1：7,3：1：3或3：1：4和hiteite; （B）环氧树脂; 和（C）固化剂。
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