Invention Grant
- Patent Title: Wiring substrate and light emitting device
- Patent Title (中): 接线基板和发光装置
-
Application No.: US14582282Application Date: 2014-12-24
-
Publication No.: US09232655B2Publication Date: 2016-01-05
- Inventor: Takuya Nakabayashi , Hiroto Tamaki
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Mori & Ward, LLP
- Priority: JP2013-264949 20131224
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H05K1/18 ; H01L33/48 ; H05K1/03 ; H05K1/09 ; H05K1/02

Abstract:
Discoloration is suppressed in a wiring substrate including a conductive member including silver. A wiring substrate includes a ceramic layer and a conductive member including a conductive layer disposed on an upper surface of the ceramic layer. The conductive member includes silver and at least a portion of an upper surface of the conductive layer is covered with a covering layer. The covering layer includes an inorganic reflecting layer and a glass layer stacked on the inorganic reflecting layer.
Public/Granted literature
- US20150181711A1 WIRING SUBSTRATE AND LIGHT EMITTING DEVICE Public/Granted day:2015-06-25
Information query
IPC分类: