公开(公告)号：US11271144B2

公开(公告)日：2022-03-08

申请号：US16222581

申请日：2018-12-17

Applicant: NICHIA CORPORATION

Inventor： Masato Fujitomo ,  Hiroto Tamaki ,  Shinji Nishijima ,  Yuichiro Tanda ,  Tomohide Miki

IPC: H01L33/48 ,  H01L33/62 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/02 ,  H01L33/52 ,  H01L25/16

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

公开(公告)号：US10763405B2

公开(公告)日：2020-09-01

申请号：US15680212

申请日：2017-08-18

Applicant: NICHIA CORPORATION

Inventor： Hiroto Tamaki

IPC: H01L33/50 ,  H01L33/54 ,  H01L23/00

Abstract: A light emitting device including a light emitting element including an element substrate and semiconductor layers formed thereon, an encapsulating member that covers the sides of the light emitting element and forms a cavity at the upper surface of the light emitting element, and a wavelength-conversion layer in the cavity. The wavelength-conversion layer being capable of converting that converts the wavelength of light emitted by the light emitting element. The wavelength-conversion layer includes a first wavelength-conversion sub layer which is disposed at the upper surface of the light emitting element, and a second wavelength-conversion sub layer which is disposed on the first wavelength-conversion sub layer. The first wavelength-conversion sub layer includes first phosphors having a first resistance to environmental exposure, and the second wavelength-conversion sub layer includes second phosphors having a second resistance which is higher than that of the first wavelength-conversion sub layer.

公开(公告)号：US10164163B2

公开(公告)日：2018-12-25

申请号：US15692542

申请日：2017-08-31

Applicant: NICHIA CORPORATION

Inventor： Masato Fujitomo ,  Hiroto Tamaki ,  Shinji Nishijima ,  Yuichiro Tanda ,  Tomohide Miki

IPC: H01L33/48 ,  H01L33/62 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/02 ,  H01L33/52 ,  H01L25/16

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

公开(公告)号：US09917236B2

公开(公告)日：2018-03-13

申请号：US15495822

申请日：2017-04-24

Applicant: NICHIA CORPORATION

Inventor： Suguru Beppu ,  Yoichi Bando ,  Hiroto Tamaki ,  Takuya Nakabayashi

IPC: H01L33/60 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L33/50 ,  H01L2224/73253 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

公开(公告)号：US09835310B2

公开(公告)日：2017-12-05

申请号：US14590520

申请日：2015-01-06

Applicant: NICHIA CORPORATION

Inventor： Hiroto Tamaki ,  Takayoshi Wakaki ,  Tadao Hayashi ,  Yoshiki Sato ,  Daisuke Oyamatsu ,  Takafumi Sugiyama ,  Takao Kosugi

IPC: H01L33/50 ,  F21V9/16 ,  B05D5/06 ,  F21V7/00 ,  H01L31/055 ,  H05B33/12 ,  C23C16/455 ,  F21V13/08 ,  F21K9/60 ,  F21Y115/30 ,  F21Y115/10

CPC classification number: F21V9/30 ,  B05D5/06 ,  C23C16/45525 ,  F21K9/60 ,  F21V7/00 ,  F21V13/08 ,  F21Y2115/10 ,  F21Y2115/30 ,  H01L31/055 ,  H01L33/502 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H05B33/12 ,  Y02E10/52 ,  Y10T428/24364 ,  Y10T428/24372 ,  Y10T428/24413 ,  Y10T428/24421 ,  H01L2924/00014

Abstract: A wave-length conversion inorganic member can includes a base body and an inorganic particle layer on the base body. The inorganic particle layer can include particles of an inorganic wave-length conversion substance which is configured to absorb light of a first wave-length and to emit light of a second wave-length different from the first wave-length. The inorganic particle layer can include an agglomerate of a plurality of the particles. Each of the plurality of the particles are in contact with at least one of the other particles or the base body. A cover layer comprises an inorganic material, and the cover layer continuously covers a surface of the base body and surfaces of the particles. The inorganic particle layer has an interstice enclosed by the particles, or by the particles and one of the base body and the cover layer.

公开(公告)号：US10270011B2

公开(公告)日：2019-04-23

申请号：US15468540

申请日：2017-03-24

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Takeshi Ikegami ,  Tadaaki Ikeda ,  Tadao Hayashi ,  Hiroto Tamaki

IPC: H01L33/48 ,  H01L33/62 ,  H01L23/00 ,  H01L25/13 ,  H01L33/38 ,  H01L33/50 ,  H01L33/54

Abstract: A light emitting device includes a base body, a light emitting element and a sealing member. The base body includes a base material and a pair of connection terminals on at least a first main surface of the base material. The light emitting element is connected to the connection terminals. The sealing member seals the light emitting element. The sealing member includes a light transmissive member disposed on an upper surface of the light emitting element, and a light shielding member sealing an end surface of the light emitting element and an end surface of the light transmissive member. The base material has a linear expansion coefficient within ±10 ppm/° C. of a linear expansion coefficient of the light emitting element.

公开(公告)号：US10096758B2

公开(公告)日：2018-10-09

申请号：US15494801

申请日：2017-04-24

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Yoshitaka Bando ,  Hiroto Tamaki

IPC: H01L23/495 ,  H01L33/62 ,  H01L21/48

Abstract: A lead frame includes a plurality of units connected together. Each unit includes a pair of lead portions spaced apart from and opposite to each other. The lead portions are configured to mount a semiconductor element and to be electrically connected to a pair of electrodes of the semiconductor element. Each lead portion includes two hook-shaped portions respectively extending from the lead portion. The hook-shaped portions of one lead portion are arranged to surround tip portions of the hook-shaped portions of the other lead portion respectively, at both sides respective to a center line of the unit.

公开(公告)号：US09768364B2

公开(公告)日：2017-09-19

申请号：US14718098

申请日：2015-05-21

Applicant: NICHIA CORPORATION

Inventor： Hiroto Tamaki

IPC: H01L33/54 ,  H01L33/50 ,  H01L23/00

CPC classification number: H01L33/507 ,  H01L24/97 ,  H01L33/505 ,  H01L33/54 ,  H01L2224/16 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2924/00012

Abstract: The light emitting device is manufactured by processing that includes forming encapsulating member at least on the upper surface and upper surface perimeter of a light emitting element, removing at least the part of the encapsulating member that is on upper surface of the light emitting element and form a cavity with a perimeter that surrounds the light emitting element, and forming a wavelength-conversion layer inside the cavity to convert the wavelength of light emitted from the light emitting element.

公开(公告)号：US09497824B2

公开(公告)日：2016-11-15

申请号：US14870007

申请日：2015-09-30

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Hiroto Tamaki

IPC: H01L33/50 ,  H01L33/60 ,  H05B33/22 ,  F21V13/08

CPC classification number: H05B33/22 ,  F21V13/08 ,  H01L33/20 ,  H01L33/486 ,  H01L33/504 ,  H01L33/505 ,  H01L33/60 ,  H01L2924/18161

Abstract: A light-emitting device includes a base, a light-emitting element, a wavelength conversion member, and a light reflecting member. The base has a base upper surface. The light-emitting element is provided on the base and includes a semiconductor layer, a light transmissive substrate, and a recess. The semiconductor layer is provided on the base so that a semiconductor lower surface faces the base upper surface of the base. The light transmissive substrate has a substrate upper surface, a substrate lower surface opposite to the substrate upper surface, and a substrate side surface between the substrate upper surface and the substrate lower surface. The light transmissive substrate is provided on the semiconductor layer so that the substrate lower surface contacts a semiconductor upper surface of the semiconductor layer. The recess is provided on the substrate upper surface of the light transmissive substrate. The wavelength conversion member is provided in the recess.

Abstract translation: 发光装置包括基座，发光元件，波长转换构件和光反射构件。 基座具有基座上表面。 发光元件设置在基底上，并且包括半导体层，透光基板和凹部。 半导体层设置在基底上，使得半导体下表面面向基底的基底上表面。 透光基板具有基板上表面，与基板上表面相对的基板下表面，以及基板上表面和基板下表面之间的基板侧面。 透光基板设置在半导体层上，使得基板下表面接触半导体层的半导体上表面。 凹部设置在透光基板的基板上表面上。 波长转换构件设置在凹部中。

公开(公告)号：US09299904B2

公开(公告)日：2016-03-29

申请号：US14716535

申请日：2015-05-19

Applicant: NICHIA CORPORATION

Inventor： Hiroto Tamaki ,  Takuya Nakabayashi

IPC: H01L33/00 ,  H01L33/62 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/16225

Abstract: A light emitting device including; a base body having a base material that includes a first main face that has a lengthwise direction and a short-side direction that is perpendicular to the lengthwise direction, a second main face on the opposite side from the first main face, a first end face that extends in the lengthwise direction, and a second end face that extends in the short-side direction, and connection terminals that are provided on the first main face of the base material; and a light emitting element that is installed on the first main face and is connected to the connection terminals, the first end face of the base material has a recess that is contiguous with the first main face and the second end face and/or is contiguous with the second main face and the second end face, a length of the recess in a lengthwise direction is greater than a depth in a short-side direction, and the connection terminals are provided extending over the recess.

Abstract translation: 一种发光器件，包括： 具有基材的基体，该基材具有长度方向和与长度方向垂直的短边方向的第一主面，与第一主面相反一侧的第二主面，第一端面 沿长边方向延伸的第二端面和沿短边方向延伸的第二端面，以及设置在基材的第一主面上的连接端子; 以及发光元件，其安装在所述第一主面上并连接到所述连接端子，所述基材的第一端面具有与所述第一主面和所述第二端面邻接的凹部和/或连续的凹部 与第二主面和第二端面相对，凹部的长度方向的长度大于短边方向的深度，连接端子设置在凹部的上方。