Invention Grant
- Patent Title: Ceramic electronic component including coating layer
- Patent Title (中): 陶瓷电子元件包括涂层
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Application No.: US13755197Application Date: 2013-01-31
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Publication No.: US09232673B2Publication Date: 2016-01-05
- Inventor: Yasuhiro Nishisaka , Yukio Sanada , Tetsuya Kisumi , Toshiki Nagamoto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2012-022320 20120203; JP2012-284453 20121227
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G4/30 ; H01G4/232 ; H05K7/00 ; H02N2/00 ; H01C7/00 ; H01C1/148 ; H01C7/18 ; H01F17/00 ; H01L41/047 ; H01F27/29

Abstract:
A ceramic electronic component includes a ceramic body; a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a coating layer covering a surface portion of the ceramic body on which the internal electrodes are exposed, the coating layer being made of a glass or resin medium in which metal powder particles are dispersed; and an electrode terminal provided directly on the coating layer and including a plating film. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal and have an elongated shape in cross section along a thickness direction of the coating layer. The metal powder particles defining the conduction paths have a maximum diameter not smaller than the thickness of the coating layer.
Public/Granted literature
- US20130200749A1 CERAMIC ELECTRONIC COMPONENT Public/Granted day:2013-08-08
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