Invention Grant
US09234120B2 Method for applying a first metal onto a second metal, an isolator or semiconductor substrate, and the respective binding units 有权
用于将第一金属施加到第二金属,隔离器或半导体衬底上的方法以及各自的结合单元

Method for applying a first metal onto a second metal, an isolator or semiconductor substrate, and the respective binding units
Abstract:
The present invention concerns a method for applying a first metal onto a second metal, an isolator or semiconductor substrate by a Diels-Alder reaction, in particular a Diels-Alder reaction with inverse electron demand. The present invention further concerns the binding units L 1960 and F 160.
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