Invention Grant
- Patent Title: Array substrate, manufacturing method and the display device thereof
- Patent Title (中): 阵列基板,制造方法及其显示装置
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Application No.: US13995932Application Date: 2012-11-23
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Publication No.: US09236405B2Publication Date: 2016-01-12
- Inventor: Xiang Liu
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOG GROUP CO., Ltd.
- Current Assignee: BOE TECHNOLOG GROUP CO., Ltd.
- Current Assignee Address: CN Beijing
- Priority: CN201210119036 20120420
- International Application: PCT/CN2012/085181 WO 20121123
- International Announcement: WO2013/155840 WO 20131024
- Main IPC: H01L27/12
- IPC: H01L27/12 ; G02F1/1368 ; H01L29/66 ; G02F1/1362

Abstract:
An array substrate, a manufacturing method thereof and a display device are provided. In the manufacturing method, the needed patterns can be formed by just three photolithography processes, wherein the semiconductor layer and the etch stop layer are formed by just one photolithography process. The method reduces one photolithography process compared to the method of the state of the art, which forms the pattern of the semiconductor layer and the etch stop layer by two photolithography processes respectively, thereby greatly reducing the manufacturing cost and improving the production efficiency.
Public/Granted literature
- US20140061635A1 Array Substrate, Manufacturing Method And The Display Device Thereof Public/Granted day:2014-03-06
Information query
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