A wire-to-board connector for connecting with a board-to-wire connector that includes a plastic body having a raised portion and two coupling portions, wherein the raised portion defines multiple through holes, each coupling portion is formed with an upright support having an enlarged top end, and multiple conductive terminals are fitted through the multiple through holes, wherein each conductive terminal has a fixed section, a solder section, and a connecting section. The wire-to-board connector comprises a dielectric housing and multiple conductive terminals. The dielectric housing defines two engaging holes and multiple positioning recesses. The conductive terminals of the wire-to-board connector are disposed in the positioning recesses for electrical connection to the connecting sections, wherein a protrusion is formed on an inner surface of each engaging hole, corresponding to the enlarged top end.