Invention Grant
US09236815B2 Compliant micro device transfer head array with metal electrodes 有权
具有金属电极的符合微器件传输头阵列

Compliant micro device transfer head array with metal electrodes
Abstract:
Compliant monopolar and bipolar micro device transfer head arrays and methods of formation from SOI substrates are described. In an embodiment, an array of compliant transfer heads are formed over a base substrate and deflectable toward the base substrate, and a patterned metal layer includes a metal interconnect layer electrically connected with an array of the metal electrodes in the array of compliant transfer heads.
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