Invention Grant
- Patent Title: Compliant micro device transfer head array with metal electrodes
- Patent Title (中): 具有金属电极的符合微器件传输头阵列
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Application No.: US13710442Application Date: 2012-12-10
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Publication No.: US09236815B2Publication Date: 2016-01-12
- Inventor: Dariusz Golda , Andreas Bibl
- Applicant: LuxVue Technology Corporation
- Applicant Address: US CA Santa Clara
- Assignee: LuxVue Technology Corporation
- Current Assignee: LuxVue Technology Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H02N13/00
- IPC: H02N13/00 ; B81C99/00

Abstract:
Compliant monopolar and bipolar micro device transfer head arrays and methods of formation from SOI substrates are described. In an embodiment, an array of compliant transfer heads are formed over a base substrate and deflectable toward the base substrate, and a patterned metal layer includes a metal interconnect layer electrically connected with an array of the metal electrodes in the array of compliant transfer heads.
Public/Granted literature
- US20140159324A1 COMPLIANT MICRO DEVICE TRANSFER HEAD ARRAY WITH METAL ELECTRODES Public/Granted day:2014-06-12
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