Invention Grant
- Patent Title: Forming of an electric connection of the via type
- Patent Title (中): 形成通孔类型的电连接
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Application No.: US14365535Application Date: 2012-12-13
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Publication No.: US09237650B2Publication Date: 2016-01-12
- Inventor: Roland Gers
- Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT
- Applicant Address: FR Paris
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALTERNATIVES
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALTERNATIVES
- Current Assignee Address: FR Paris
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR1161643 20111214
- International Application: PCT/EP2012/075364 WO 20121213
- International Announcement: WO2013/087760 WO 20130620
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H01L21/768 ; H01L23/48 ; H01L25/065 ; H01L25/00 ; H01L23/00 ; H01L23/498

Abstract:
A method and an electronic component including: a substrate including at least a hole at least partially going through a thickness of the substrate; an electrically conducting element positioned in the hole and configured to form an electric connection through the hole, wherein the electrically conducting element includes an electrically conducting and self-supporting pillar with a height oriented according to the thickness of the substrate; and a space between at least a part of the wall of the hole and a part of a peripheral wall of the pillar.
Public/Granted literature
- US20140346680A1 FORMING OF AN ELECTRIC CONNECTION OF THE VIA TYPE Public/Granted day:2014-11-27
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