Invention Grant
US09237650B2 Forming of an electric connection of the via type 有权
形成通孔类型的电连接

Forming of an electric connection of the via type
Abstract:
A method and an electronic component including: a substrate including at least a hole at least partially going through a thickness of the substrate; an electrically conducting element positioned in the hole and configured to form an electric connection through the hole, wherein the electrically conducting element includes an electrically conducting and self-supporting pillar with a height oriented according to the thickness of the substrate; and a space between at least a part of the wall of the hole and a part of a peripheral wall of the pillar.
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