Invention Grant
- Patent Title: Blower assembly for electronic device
- Patent Title (中): 电子设备鼓风机总成
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Application No.: US13630918Application Date: 2012-09-28
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Publication No.: US09239060B2Publication Date: 2016-01-19
- Inventor: Douglas Heymann
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alpine Technology Law Group LLC
- Main IPC: F04D17/04
- IPC: F04D17/04 ; F04D25/06 ; F04D29/42 ; H05K7/20

Abstract:
In one embodiment a blower comprises a case comprising a first surface, a second surface opposite the first surface, and a side wall extending between portions of the first surface and the second surface, wherein the side wall comprises an air inlet and an air outlet, an impeller disposed in the case and rotatable about an axis of rotation extending between the first surface and the second surface. Portions of the side wall are disposed at least a first distance from the axis of rotation and the impeller is to define a circumferential airflow path within the case, and the impeller is to create an airflow in the circumferential airflow path between the air inlet and the air outlet.
Public/Granted literature
- US20140092553A1 BLOWER ASSEMBLY FOR ELECTRONIC DEVICE Public/Granted day:2014-04-03
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