Invention Grant
- Patent Title: Module arrangement
- Patent Title (中): 模块安排
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Application No.: US14001103Application Date: 2011-03-14
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Publication No.: US09241416B2Publication Date: 2016-01-19
- Inventor: Michael Berner , Ralf Forcht
- Applicant: Michael Berner , Ralf Forcht
- Applicant Address: DE Esslingen
- Assignee: FESTO AG & CO. KG
- Current Assignee: FESTO AG & CO. KG
- Current Assignee Address: DE Esslingen
- Agency: Hoffmann & Baron, LLP
- International Application: PCT/EP2011/001241 WO 20110314
- International Announcement: WO2012/122996 WO 20120920
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K7/02 ; F15B13/08 ; F16K27/00

Abstract:
A module arrangement including a plurality of functional modules lined up in a stacking direction, which are connected to one another for fluidic and electric communication, wherein a functional module includes a plate-shaped base body having two parallel, opposite joining surfaces which are designed to contact joining surfaces of adjacent base bodies, wherein the base body includes a connecting device designed for transferring electric signals and/or electric supply voltages and/or fluid flows between adjacent functional modules along the stacking direction, and wherein several signal lines selectable by the control module extend along the stacking direction of the functional modules for transmitting control signals provided for the direct selection of individual functional modules wherein at least one storage device for detecting, buffering and transferring at least one electric signal of an external component is electrically looped into at least one signal line.
Public/Granted literature
- US20130329377A1 Module Arrangement Public/Granted day:2013-12-12
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