发明授权
- 专利标题： Heating device
- 专利标题（中）： 加热装置
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申请号： US13864559申请日： 2013-04-17
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公开(公告)号： US09245775B2公开(公告)日： 2016-01-26
- 发明人: Nobuyuki Kondo , Morimichi Watanabe , Asumi Jindo , Yuji Katsuda , Yosuke Sato , Yoshinori Isoda
- 申请人： NGK INSULATORS, LTD.
- 申请人地址： JP Nagoya
- 专利权人： NGK Insulators, Ltd.
- 当前专利权人： NGK Insulators, Ltd.
- 当前专利权人地址： JP Nagoya
- 代理机构： Burr & Brown, PLLC
- 优先权： JP2010-239000 20101025; JP2011-135312 20110617; WOPCT/JP2011/069479 20110829
- 主分类号： H05B3/06
- IPC分类号： H05B3/06 ; H01L21/67 ; C04B35/581 ; H05B1/00 ; B32B18/00 ; H05B3/28 ; H01L21/683 ; C04B35/58 ; C04B35/626 ; C04B35/645 ; C04B37/00 ; C23C14/34
摘要：
A heating apparatus 11A includes a susceptor having a heating face 12a of heating a semiconductor. The susceptor includes a plate shaped main body 13 and a surface corrosion resistant layer 14 including the heating face. The surface corrosion resistant layer 14 is made of a ceramic material comprising magnesium, aluminum, oxygen and nitrogen as main components. The ceramic material comprises a main phase comprising magnesium-aluminum oxynitride phase exhibiting an XRD peak at least in 2θ=47 to 50° by CuKα X-ray.
公开/授权文献
- US20130228566A1 HEATING DEVICE 公开/授权日：2013-09-05
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