Invention Grant
- Patent Title: Method and layout of an integrated circuit
- Patent Title (中): 集成电路的方法和布局
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Application No.: US13955796Application Date: 2013-07-31
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Publication No.: US09245887B2Publication Date: 2016-01-26
- Inventor: Ting-Wei Chiang , Chun-Fu Chen , Hsiang-Jen Tseng , Wei-Yu Chen , Hui-Zhong Zhuang , Shang-Chih Hsieh , Li-Chun Tien
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H01L27/092 ; H01L27/02 ; H01L27/088 ; H01L21/8234

Abstract:
An integrated circuit layout includes a first active region, a second active region, a first PODE (poly on OD edge), a second PODE, a first transistor and a second transistor. The first transistor, on the first active region, includes a gate electrode, a source region and a drain region. The second transistor, on the second active region, includes a gate electrode, a source region and a drain region. The first active region and the second active region are adjacent and electrically disconnected with each other. The first PODE and the second PODE are on respective adjacent edges of the first active region and the second active region. The source regions of the first and second transistor are adjacent with the first PODE and the second PODE respectively. The first PODE and the second PODE are sandwiched between source regions of the first transistor and the second transistor.
Public/Granted literature
- US20150035070A1 METHOD AND LAYOUT OF AN INTEGRATED CIRCUIT Public/Granted day:2015-02-05
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