Invention Grant
- Patent Title: Light-emitting device and fabrication method thereof
- Patent Title (中): 发光元件及其制造方法
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Application No.: US14748516Application Date: 2015-06-24
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Publication No.: US09246053B2Publication Date: 2016-01-26
- Inventor: Xinghua Liang , Te-Ling Hsia , Chenke Hsu , Chih-Wei Chao , Shuiqing Li
- Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Xiamen
- Assignee: Xiamen Sanan Optoelectronics Technology Co., Ltd.
- Current Assignee: Xiamen Sanan Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Xiamen
- Agency: Syncoda LLC
- Agent Feng Ma
- Priority: CN201310193631 20130523
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/02 ; H01L33/14 ; H01L33/10

Abstract:
A light-emitting device of little aging electric leakage and high luminous efficiency and fabrication thereof, in which, the light-emitting device includes: a semiconductor epitaxial laminated layer that comprises an N-type semiconductor layer, a P-type semiconductor layer and a light-emitting layer between the N-type semiconductor layer and the P-type semiconductor layer, the surface of which has deflected dislocation; electromigration resistant metal that fills into the deflected dislocation over the N-type or/and P-type semiconductor layer surface through pretreatment to block the electromigration channel formed over the semiconductor epitaxial laminated layer due to deflected dislocation to eliminate electric leakage.
Public/Granted literature
- US20150295130A1 Light-Emitting Device and Fabrication Method Thereof Public/Granted day:2015-10-15
Information query
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