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公开(公告)号：US09966514B2
公开(公告)日：2018-05-08
申请号：US15192993
申请日：2016-06-24
Inventor： Chen-Ke Hsu , Junpeng Shi , Pei-Song Cai , Zhenduan Lin , Hao Huang , Chenjie Liao , Chih-Wei Chao , Qiuxia Lin
CPC classification number: H01L33/60 , H01L33/505 , H01L33/507 , H01L33/508 , H01L33/54 , H01L33/62 , H01L2224/04105 , H01L2224/19 , H01L2924/18162 , H01L2933/0016 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0091
Abstract: A light emitting diode package structure allows for an improved light-emitting efficiency by including a first reflecting material layer with through holes; a flip chip on the first reflecting material layer, with the electrodes inlaid in the through holes of the first reflecting material layer; a first transparent material layer surrounding the side surface of the flip chip except the electrodes; and a second reflecting material layer surrounding the first transparent material layer. An interface between the first transparent material layer and the reflecting material layer is an inclined plane, an arc plane, or an irregular shape, to thereby facilitate upward light reflection of the flip chip. A wavelength conversion material layer is over the first reflecting material layer, the flip chip, and the second reflecting material layer.
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公开(公告)号：US09825203B2
公开(公告)日：2017-11-21
申请号：US15186487
申请日：2016-06-19
Inventor： Jiansen Zheng , Su-Hui Lin , Chen-Ke Hsu , Chih-Wei Chao
CPC classification number: H01L33/24 , H01L33/14 , H01L33/145 , H01L33/38 , H01L33/44 , H01L2933/0016 , H01L2933/0033
Abstract: A light emitting diode chip includes an epitaxial layer with a plurality of recess portions and protrusion portions over the top layer; a light transmission layer, located between top ends of adjacent protrusion portions and forming holes with the recess portions. The light transmission layer has a horizontal dimension larger than a width of the top ends of two adjacent protrusion portions, and serves as current blocking layer; a current spreading layer covering the surface of the light transmission layer and the surface of an epitaxial layer of a non-mask light transmission layer. As the refractive index of the light transmission layer is between those of the epitaxial layer and the hole, indicating a difference of refractive index between the light transmission layer and the epitaxial layer, the probability of scattering generated when light from a luminescent layer emits upwards can be increased, thus avoiding light absorption by electrodes and improving light extraction efficiency.
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公开(公告)号：US09711704B2
公开(公告)日：2017-07-18
申请号：US15232494
申请日：2016-08-09
Inventor： Jun-Peng Shi , Pei-Song Cai , Hao Huang , Xing-Hua Liang , Zhen-Duan Lin , Chih-Wei Chao , Chen-Ke Hsu
CPC classification number: H01L33/647 , H01L24/97 , H01L25/0753 , H01L33/483 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2924/12041
Abstract: A light-emitting diode (LED) package, including: a substrate with front and back surfaces, including: at least two metal blocks; an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and an electrical insulation region between the at least two metal blocks; an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate; wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate.
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公开(公告)号：US09306138B2
公开(公告)日：2016-04-05
申请号：US14742538
申请日：2015-06-17
Inventor： Chih-Wei Chao , Yen-Chih Chiang
CPC classification number: H01L33/60 , H01L33/20 , H01L33/34 , H01L33/385 , H01L33/46 , H01L33/483 , H01L33/486 , H01L33/50 , H01L33/62 , H01L33/642
Abstract: A packaging structure of a vertical LED chip includes at least a support system, a glue cup that connects to periphery of the support system, a LED chip with light absorption substrate over the support system and packaging glue distributed in periphery of the LED chip, wherein the packaging structure also comprises a baffle that surrounds the outer side wall of the light absorption substrate. Adding of a baffle structure in the support system of the packaging structure can effectively prevent light from being absorbed by the light absorption substrate and reflect such light out of the packaging structure, thus increasing probability of light emitting and improving light intensity of the vertical LED chip.
Abstract translation: 垂直LED芯片的封装结构至少包括支撑系统，连接到支撑系统的周边的胶杯，在支撑系统上具有吸光基板的LED芯片和分布在LED芯片周边的封装胶，其中 封装结构还包括围绕光吸收衬底的外侧壁的挡板。 在包装结构的支撑系统中添加挡板结构可以有效地防止光被光吸收基板吸收并将这种光反射出包装结构，从而增加发光的可能性并提高垂直LED芯片的光强度 。
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公开(公告)号：US11217732B2
公开(公告)日：2022-01-04
申请号：US16810523
申请日：2020-03-05
Inventor： Senpeng Huang , Junpeng Shi , Weng-Tack Wong , Shunyi Chen , Zhenduan Lin , Chih-Wei Chao , Chen-Ke Hsu
Abstract: The present invention provides a white light LED package structure and a white light source system, which includes a substrate, an LED chip, and a wavelength conversion material layer. The peak emission wavelength of the LED chip is between 400 nm and 425 nm; the peak emission wavelength of the wavelength conversion material layer is between 440 nm and 700 nm, and the wavelength conversion material layer absorbs light emitted from the LED chip and emits a white light source; and the emission spectrum of the white light source is set as P(λ), the emission spectrum of a blackbody radiation having the same color temperature as the white light source is S(λ), P(λmax) is the maximum light intensity within 380-780 nm, S(λmax) is the maximum light intensity of the blackbody radiation within 380-780 nm, D(λ) is a difference between the spectrum of the white light LED and the spectrum of the blackbody radiation, and within 510-610 nm, the white light source satisfies: D(λ)=P(λ)/P(λmax)−S(W)/S(λmax), −0.15
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Patent Agency Ranking
公开(公告)号：US10249789B2
公开(公告)日：2019-04-02
申请号：US15658375
申请日：2017-07-24
Inventor： Jiansen Zheng , Su-Hui Lin , Chen-Ke Hsu , Chih-Wei Chao
Abstract: A light-emitting diode chip includes an epitaxial layer with a plurality of recess portions and protrusion portions; and a light transmission layer having a plurality of light transmission portions between top ends of adjacent protrusion portions and forming holes with the recess portions. The light transmission portions have a horizontal dimension larger than a width of the top ends of two adjacent protrusion portions, and serve as current blocking layer. A current spreading layer covers the light transmission layer and the epitaxial layer not masked by the light transmission layer. A refractive index of the light transmission layer is between those of the epitaxial layer and the holes, indicating a difference of refractive index between the light transmission layer and the epitaxial layer. Light scattering probability can therefore be increased, thus avoiding light absorption by electrodes and improving light extraction efficiency.
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公开(公告)号：US09202974B2
公开(公告)日：2015-12-01
申请号：US14712867
申请日：2015-05-14
Inventor： Shaohua Huang , Chih-Wei Chao
CPC classification number: H01L33/08 , H01L25/0756 , H01L33/0066 , H01L33/0075 , H01L33/0079 , H01L33/32 , H01L33/36 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2933/0066 , H01L2924/00
Abstract: A double-sided LED has a double-sided light emitting structure formed by electroplating or electrocasting without the need for wire bonding. The double-sided light emitting gives the chip a light-emitting angle of 150 degrees or higher. In addition, the device has good light extraction and heat dissipation characteristics.
Abstract translation: 双面LED具有通过电镀或电铸形成的双面发光结构，而不需要引线接合。 双面发光使芯片的发光角度为150度以上。 此外，该装置具有良好的光提取和散热特性。
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公开(公告)号：US12002796B2
公开(公告)日：2024-06-04
申请号：US17804888
申请日：2022-06-01
Inventor： Shunyi Chen , Junpeng Shi , Weng-Tack Wong , Chen-ke Hsu , Chih-Wei Chao
CPC classification number: H01L25/167 , H01L33/483 , H01L33/60 , H01L33/62
Abstract: An LED device includes a substrate, a conductive layer, an LED chip, and a discharge element. The substrate has upper and lower surfaces and four edges interconnected to one another and surrounding the upper surface. The conductive layer is formed on the upper surface, and has first and second regions electrically separated by a trench. The trench has a first segment inclined relative to each edge of the substrate by a predetermined angle ranging between 0 and 90 degrees, and a second segment connected to the first segment. The LED chip is disposed across the first segment, and the discharge element is disposed across the second segment, both interconnecting the first and second regions.
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公开(公告)号：US11271362B2
公开(公告)日：2022-03-08
申请号：US16831512
申请日：2020-03-26
Inventor： Hui Chen , Junpeng Shi , Xinglong Li , Chi-Wei Liao , Weng-Tack Wong , Chih-Wei Chao , Chen-ke Hsu
IPC: H01S5/00 , H01S5/024 , H01S5/06 , H01S5/40 , H01S5/02255 , F21V7/00 , H01S5/02208
Abstract: The laser device includes a substrate, a laser element disposed on the substrate for emitting a laser light ray, a light guide member disposed on the substrate, and a wavelength conversion layer. The light guide member is light-transmissible and thermally conductive, and has at least one reflection surface for reflecting the laser light ray from the laser element so as to change travelling direction of the laser light ray. The wavelength conversion layer converts wavelength of the laser light ray from the light guide member to result in a laser beam, and contacts the light guide member so that heat from the wavelength conversion layer is transferred to the substrate through the light guide member.
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公开(公告)号：US09437793B2
公开(公告)日：2016-09-06
申请号：US14606038
申请日：2015-01-27
Inventor： Jun-Peng Shi , Pei-Song Cai , Hao Huang , Xing-Hua Liang , Zhen-Duan Lin , Chih-Wei Chao , Chen-Ke Hsu
CPC classification number: H01L33/647 , H01L24/97 , H01L25/0753 , H01L33/483 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2924/12041
Abstract: A package support including: metal frames connected together; one or more dielectric materials disposed in an inner gap of the metal frames; wherein: the package support has a frame region and a function region; wherein the function region has complete upper and lower surfaces configured to prevent leakage if at least one of the entire upper or lower surfaces is covered with an encapsulant material. A fabrication method allows for manufacturing the package support with a high cell density, relatively low price, high reflectivity, good heat dissipation, and high reliability. The LED package using the package support has a smaller size and improved dissipation properties.
Abstract translation: 包装支架包括：连接在一起的金属框架; 设置在金属框架的内部间隙中的一个或多个介电材料; 其中：所述包装支架具有框架区域和功能区域; 其中所述功能区域具有完整的上表面和下表面，其被配置为如果整个上表面或下表面中的至少一个被密封剂材料覆盖，则防止泄漏。 制造方法允许以高电池密度，相对低的价格，高反射率，良好的散热性和高可靠性制造封装支架。 使用封装支持的LED封装具有更小的尺寸和改善的耗散性能。
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