Invention Grant
- Patent Title: Leadframe for a contact module and method of manufacturing the same
- Patent Title (中): 触点模块的引线框架及其制造方法
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Application No.: US14069012Application Date: 2013-10-31
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Publication No.: US09246293B2Publication Date: 2016-01-26
- Inventor: Michael Joseph Vino, IV , Leo Joseph Graham , Michael Christopher D'Imperio , David Allison Trout , Wayne Samuel Davis , Rodney Timothy Yancey , Jeffrey Byron McClinton
- Applicant: Tyco Electronics Corporation
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R9/24
- IPC: H01R9/24 ; H01R43/16 ; H01R12/72 ; H01R13/6587

Abstract:
A leadframe for a contact module includes signal contacts arranged in pairs carrying differential signals. Each pair of signal contacts includes a first signal contact and a second signal contact. Each signal contact has a mating beam at an end thereof configured to be electrically connected to a corresponding header contact of a header assembly. Each mating beam includes a stem and a branch extending from the stem. A first paddle extends from the stem and a second paddle extends from the branch. In an initial, stamped orientation, the mating beams are stamped such that the mating beams of the first and second signal contacts within the same pair of signal contacts are angled non-parallel to one another.
Public/Granted literature
- US20150118921A1 LEADFRAME FOR A CONTACT MODULE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-04-30
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