Invention Grant
- Patent Title: Composite wall panel with low thermal conductivity and sufficient strength for structural use
- Patent Title (中): 复合墙面板具有低导热性和足够强度的结构用途
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Application No.: US13769808Application Date: 2013-02-18
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Publication No.: US09249053B2Publication Date: 2016-02-02
- Inventor: Christopher Kin Ying Leung , Kwok Fai Cheung , Honggang Zhu , Sze Wai Lin
- Applicant: Nano and Advanced Materials Institute Limited
- Applicant Address: HK Hong Kong
- Assignee: NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Current Assignee: NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Current Assignee Address: HK Hong Kong
- Agency: Ella Cheong Hong Kong
- Agent Sam T. Yip
- Main IPC: C04B26/00
- IPC: C04B26/00 ; B32B5/18 ; B32B7/02 ; B32B13/02 ; E04B2/00 ; C04B28/02 ; C04B38/10 ; B32B13/04 ; E04C2/04 ; E04B2/84 ; C04B111/00 ; E04B1/80 ; E04C5/07

Abstract:
The present invention provides a composite wall panel with good thermal insulation and sufficient strength for structural use which is designed for the fabrication of energy efficient building. The composite wall panel of the present invention comprises a foamed concrete core with sufficient compressive strength and low thermal conductivity which is sandwiched between two lightweight ductile fiber reinforced cementitious composite (FRCC) protective layers with low thermal conductivity, good barrier resistance to moisture/chloride ion/gas, multiple cracking as well as certain amount of steel reinforcements. These composite wall panels are useful in a variety of buildings in both cold and hot regions.
Public/Granted literature
- US20130216802A1 COMPOSITE WALL PANEL WITH LOW THERMAL CONDUCTIVITY AND SUFFICIENT STRENGTH FOR STRUCTURAL USE Public/Granted day:2013-08-22
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