Invention Grant
- Patent Title: Semiconductor device grid array package
- Patent Title (中): 半导体器件栅格阵列封装
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Application No.: US14551070Application Date: 2014-11-23
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Publication No.: US09252114B2Publication Date: 2016-02-02
- Inventor: Zhijie Wang , Zhigang Bai , Aipeng Shu , Yanbo Xu , Huchang Zhang , Fei Zong
- Applicant: Zhijie Wang , Zhigang Bai , Aipeng Shu , Yanbo Xu , Huchang Zhang , Fei Zong
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Agent Charles E. Bergere
- Priority: CN201410137295 20140227
- Main IPC: H01L23/04
- IPC: H01L23/04 ; H01L23/00 ; H01L23/31
Abstract:
A grid array assembly is formed from an electrical insulating material with embedded solder deposits. A first portion of each of the solder deposits is exposed on a first surface of the insulating material and a second portion of each of the solder deposits is exposed on an opposite surface of the insulating material. A semiconductor die is mounted to the first surface of the insulating material and electrodes of the die are connected to the solder deposits with bond wires. The die, bond wires, and the first surface of the insulating material then are covered with a protective encapsulating material.
Public/Granted literature
- US20150243623A1 SEMICONDUCTOR DEVICE GRID ARRAY PACKAGE Public/Granted day:2015-08-27
Information query
IPC分类:
