Invention Grant
- Patent Title: High-voltage conduction path and wiring harness
- Patent Title (中): 高压传导路径和线束
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Application No.: US14162827Application Date: 2014-01-24
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Publication No.: US09252575B2Publication Date: 2016-02-02
- Inventor: Eiichi Toyama , Shigemi Hashizawa
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-161511 20110725
- Main IPC: H01B9/00
- IPC: H01B9/00 ; H02G3/02 ; B60R16/02 ; H05K9/00 ; H02G3/38 ; H01R9/05 ; H01B7/00 ; H01B9/04 ; H01R4/18 ; H01R4/20 ; H02G3/04

Abstract:
A high-voltage conduction path includes one conductor of a positive electrode conductor and a negative electrode conductor, a first insulator on the outside of the one conductor, the other conductor of the positive electrode conductor and the negative electrode conductor, the other conductor on the outside of the first insulator, and a second insulator on the outside of the other conductor. The other conductor is made of a metal wire material and formed into a cylindrical shape by spirally winding the metal wire material, and portions of the metal wire material positioned to be adjacent to each other contact with each other at side end faces opposed to each other.
Public/Granted literature
- US20140138153A1 HIGH-VOLTAGE CONDUCTION PATH AND WIRING HARNESS Public/Granted day:2014-05-22
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