发明授权
- 专利标题: Silicon carbide substrate and method of manufacturing the same
- 专利标题(中): 碳化硅基板及其制造方法
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申请号: US13605265申请日: 2012-09-06
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公开(公告)号: US09255344B2公开(公告)日: 2016-02-09
- 发明人: Shin Harada , Shinsuke Fujiwara , Taro Nishiguchi
- 申请人: Shin Harada , Shinsuke Fujiwara , Taro Nishiguchi
- 申请人地址: JP Osaka-shi, Osaka
- 专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人地址: JP Osaka-shi, Osaka
- 代理机构: Drinker Biddle & Reath LLP
- 优先权: JP2011-205513 20110921
- 主分类号: C30B23/00
- IPC分类号: C30B23/00 ; C30B29/36 ; C30B35/00 ; H01L21/02
摘要:
A silicon carbide substrate capable of stably forming a device of excellent performance, and a method of manufacturing the same are provided. A silicon carbide substrate is made of a single crystal of silicon carbide, and has a width of not less than 100 mm, a micropipe density of not more than 7 cm−2, a threading screw dislocation density of not more than 1×104 cm−2, a threading edge dislocation density of not more than 1×104 cm−2, a basal plane dislocation density of not more than 1×104 cm−2, a stacking fault density of not more than 0.1 cm−1, a conductive impurity concentration of not less than 1×1018 cm−3, a residual impurity concentration of not more than 1×1016 cm−3, and a secondary phase inclusion density of not more than 1 cm−3.
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