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US09257359B2 System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3D chip stacks 有权
在3D芯片堆叠中使用的热界面材料中处理水平对准的石墨纳米纤维的系统和方法

System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3D chip stacks
Abstract:
The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes placing a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip.
Abstract(Chinese):

具有增强的冷却装置的半导体芯片的芯片堆叠包括具有第一侧上的电路的第一芯片和通过连接器格栅电和机械地耦合到第一芯片的第二芯片。 该装置还包括放置在第一芯片和第二芯片之间的热界面材料垫，其中热界面材料垫包括平行于第一芯片和第二芯片的配合表面排列的纳米纤维。 该方法包括在第一侧上创建具有电路的第一芯片，并通过连接器网格将第二芯片电连接并机械耦合到第一芯片。 该方法还包括在第一芯片和第二芯片之间放置热界面材料垫，其中热界面材料垫包括平行于第一芯片和第二芯片的配合表面排列的纳米纤维。

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