Invention Grant
US09257381B2 Semiconductor package, and interposer structure of the semiconductor package 有权
半导体封装和半导体封装的内插器结构

Semiconductor package, and interposer structure of the semiconductor package
Abstract:
A method of fabricating a semiconductor package is provided, including: cutting a substrate into a plurality of interposers; disposing the interposers in a plurality of openings of a carrier, wherein the openings are spaced from one another by a distance; forming a first encapsulant to encapsulate the interposers; removing the carrier; and disposing at least a semiconductor element on each of the interposers. By cutting the substrate first, good interposers can be selected and rearranged such that finished packages can be prevented from being wasted due to inferior interposers.
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