Invention Grant
- Patent Title: Semiconductor package, and interposer structure of the semiconductor package
- Patent Title (中): 半导体封装和半导体封装的内插器结构
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Application No.: US13722017Application Date: 2012-12-20
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Publication No.: US09257381B2Publication Date: 2016-02-09
- Inventor: Kuan-Wei Chuang , Chun-Tang Lin , Yi-Chian Liao , Yi-Che Lai
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW101132953A 20120910
- Main IPC: H01L23/14
- IPC: H01L23/14 ; H01L23/498 ; H01L21/78 ; H01L23/00 ; H01L21/48
Abstract:
A method of fabricating a semiconductor package is provided, including: cutting a substrate into a plurality of interposers; disposing the interposers in a plurality of openings of a carrier, wherein the openings are spaced from one another by a distance; forming a first encapsulant to encapsulate the interposers; removing the carrier; and disposing at least a semiconductor element on each of the interposers. By cutting the substrate first, good interposers can be selected and rearranged such that finished packages can be prevented from being wasted due to inferior interposers.
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