发明授权
- 专利标题： Integrated circuit packaging system with substrate and method of manufacture thereof
- 专利标题（中）： 具有基板的集成电路封装系统及其制造方法
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申请号： US13488812申请日： 2012-06-05
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公开(公告)号： US09257384B2公开(公告)日： 2016-02-09
- 发明人: Soohan Park , Sung Jun Yoon
- 申请人： Soohan Park , Sung Jun Yoon
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 主分类号： H01L29/66
- IPC分类号： H01L29/66 ; H01L23/498 ; H01L23/00 ; H01L21/56
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting a stack substrate over the base substrate with an inter-substrate connector directly on the stack substrate and the base substrate, the inter-substrate connector having an inter-substrate connector pitch; mounting an integrated circuit over the stack substrate, the integrated circuit having an internal connector directly on the stack substrate; and attaching an external connector directly on the base substrate, the external connector having an external connector pitch greater than the inter-substrate connector pitch.
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