Various embodiments may relate to a method for producing a passive electronic component, including forming a first electrically conductive layer on a substrate, forming a second electrically conductive layer on the first electrically conductive layer, forming a first trench in the first and second electrically conductive layers such that the substrate is exposed in the first trench, wherein the first trench separates a first contact region from a second contact region, applying a dielectric in a structured fashion to the second electrically conductive layer in the first contact region and at least partly to the substrate in the first trench such that the dielectric electrically insulates the first contact region from the second contact region, and applying an electrically conductive electrode layer in a structured fashion to the dielectric above the first contact region and to the second contact region.