Invention Grant
US09263289B2 Adhesion-promoting composition used between curable composition for imprints and substrate, and semiconductor device using the same
有权
用于压印的可固化组合物和基材之间使用的粘合促进组合物，以及使用其的半导体装置
- Patent Title: Adhesion-promoting composition used between curable composition for imprints and substrate, and semiconductor device using the same
- Patent Title (中): 用于压印的可固化组合物和基材之间使用的粘合促进组合物，以及使用其的半导体装置
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Application No.: US14550473Application Date: 2014-11-21
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Publication No.: US09263289B2Publication Date: 2016-02-16
- Inventor: Akiko Hattori , Hirotaka Kitagawa , Yuichiro Enomoto
- Applicant: FUJIFILM CORPORATION
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-136895 20120618
- Main IPC: C08G59/00
- IPC: C08G59/00 ; H01L21/308 ; C08F299/02 ; G03F7/00 ; C09J163/10 ; G03F7/038
Abstract:
Provided is an adhesion-promoting composition between a curable composition for imprints and a substrate, which excellent in adhesiveness and can control pattern failure. An adhesion-promoting composition used between a curable composition for imprints and a substrate, which comprises a compound having a molecular weight of 500 or larger and having a reactive group, and has a content of a compound, with a molecular weight of 200 or smaller, of more than 1% by mass and not more than 10% by mass of a total solid content.
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