Invention Grant
US09263329B2 Methods of connecting a first electronic package to a second electronic package
有权
将第一电子封装连接到第二电子封装的方法
- Patent Title: Methods of connecting a first electronic package to a second electronic package
- Patent Title (中): 将第一电子封装连接到第二电子封装的方法
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Application No.: US14219749Application Date: 2014-03-19
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Publication No.: US09263329B2Publication Date: 2016-02-16
- Inventor: Chia-Pin Chiu , Kinya Ichikawa , Yoshihiro Tomita , Robert L. Sankman , Eric Li
- Applicant: Intel Corporation
- Applicant Address: US MN Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US MN Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/4763 ; H01L21/768 ; H01L25/00 ; H01L25/065 ; H01L23/00 ; H01L21/56
Abstract:
A method of fabricating an electronic package. The method includes filling a mold with an electric conductor to form a number of electrical interconnects within the mold. The mold includes openings that are filled with several electric conductors to form a number of electrical interconnects. The method of fabricating an electronic package further includes attaching the mold to a substrate such that the electrical interconnects engage electrical contacts on the substrate. The method of fabricating an electronic package may further include forming conductive pads on the electrical insulator that engage the electrical interconnects and attaching a die to the substrate such that the die is electrically connected to at least some of the electrical interconnects.
Public/Granted literature
- US20150270169A1 METHODS OF CONNECTING A FIRST ELECTRONIC PACKAGE TO A SECOND ELECTRONIC PACKAGE Public/Granted day:2015-09-24
Information query
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