Disclosed is a singulation apparatus for cutting a workpiece. The singulation apparatus comprises: i) a processor; ii) at least one chuck device for securing the workpiece to be cut; iii) a cutting device spaced from the at least one chuck device by a separation distance, the cutting device being for cutting the workpiece secured to the at least one chuck device; and iv) an imaging device operable to capture one or more images comprising the cutting device and a reference feature. In particular, the processor is configured to determine a separation distance between the cutting device and the reference feature based on the one or more images as captured by the imaging device, to thereby determine the separation distance between the cutting device and the workpiece as secured to the at least one chuck device.