发明授权
US09263375B2 System, method and apparatus for leadless surface mounted semiconductor package
有权
无铅表面贴装半导体封装的系统，方法和装置
- 专利标题： System, method and apparatus for leadless surface mounted semiconductor package
- 专利标题（中）： 无铅表面贴装半导体封装的系统，方法和装置
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申请号： US14341292申请日： 2014-07-25
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公开(公告)号： US09263375B2公开(公告)日： 2016-02-16
- 发明人: Lakshminarayan Viswanathan , Lakshmi N. Ramanathan , Audel A. Sanchez , Fernando A. Santos
- 申请人： Lakshminarayan Viswanathan , Lakshmi N. Ramanathan , Audel A. Sanchez , Fernando A. Santos
- 申请人地址： US TX Austin
- 专利权人： FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人： FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人地址： US TX Austin
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/00 ; H01L21/56 ; H01L21/48 ; H01L23/31 ; H01L23/367
摘要：
A packaged semiconductor device may include a termination surface having terminations configured as leadless interconnects to be surface mounted to a printed circuit board. A first flange has a first surface and a second surface. The first surface provides a first one of the terminations, and the second surface is opposite to the first surface. A second flange also has a first surface and a second surface, with the first surface providing a second one of the terminations, and the second surface is opposite to the first surface. A die is mounted to the second surface of the first flange with a material having a melting point in excess of 240° C. An electrical interconnect extends between the die and the second surface of the second flange opposite the termination surface, such that the electrical interconnect, first flange and second flange are substantially housed within a body.