Invention Grant
- Patent Title: Method of forming a semiconductor structure
- Patent Title (中): 形成半导体结构的方法
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Application No.: US14587747Application Date: 2014-12-31
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Publication No.: US09263565B2Publication Date: 2016-02-16
- Inventor: Po-Chih Chen , Jiun-Lei Jerry Yu , Fu-Wei Yao , Chun-Wei Hsu , Fu-Chih Yang , Chun Lin Tsai
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/778 ; H01L29/205 ; H01L29/20

Abstract:
A semiconductor structure comprises a first layer. The first layer comprises a first III-V semiconductor material. The semiconductor structure also comprises a second layer over the first layer. The second layer comprises a second III-V semiconductor material different from the first III-V semiconductor material. The semiconductor structure further comprises an insulating layer over the second layer. The insulating layer is patterned to expose a portion of the first layer. The exposed portion of the first layer comprises electrons of the second layer. The semiconductor structure additionally comprises an intermetallic compound over the exposed portion of the first layer.
Public/Granted literature
- US20150115328A1 METHOD OF FORMING A SEMICONDUCTOR STRUCTURE Public/Granted day:2015-04-30
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