Invention Grant
US09264010B2 Via structure having open stub and printed circuit board having the same
有权
具有开放短截线的通孔结构和具有其的印刷电路板
- Patent Title: Via structure having open stub and printed circuit board having the same
- Patent Title (中): 具有开放短截线的通孔结构和具有其的印刷电路板
-
Application No.: US14027835Application Date: 2013-09-16
-
Publication No.: US09264010B2Publication Date: 2016-02-16
- Inventor: Dong Hwan Lee , Seung Wook Park , Christian Romero , Young Do Kweon , Jin Gu Kim
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2012-0103421 20120918
- Main IPC: H03H7/01
- IPC: H03H7/01 ; H05K1/02 ; H05K1/11
Abstract:
The present invention relates to a via structure having an open stub and a printed circuit board having the same. In accordance with an embodiment of the present invention, a via structure having an open stub including: a signal transmission via passing through an insulating layer; upper and lower via pads for connecting first and second transmission lines, which are respectively formed on and under the insulating layer, and the signal transmission via; and at least one open stub connected to an outer periphery of each via pad to have a shunt capacitance with each ground pattern formed on and under the insulating layer is provided. Further, a printed circuit board with a via having an open stub is provided.
Public/Granted literature
- US20140077896A1 VIA STRUCTURE HAVING OPEN STUB AND PRINTED CIRCUIT BOARD HAVING THE SAME Public/Granted day:2014-03-20
Information query
