Invention Grant
- Patent Title: Method of making flexible, foldable, and stretchable devices
- Patent Title (中): 制造柔性，可折叠和可拉伸装置的方法
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Application No.: US14418203Application Date: 2013-07-31
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Publication No.: US09269588B2Publication Date: 2016-02-23
- Inventor: Yong Xu , Hongen Tu , Eric G R Kim , Jessin K. John
- Applicant: Wayne State University
- Applicant Address: US MI Detroit
- Assignee: WAYNE STATE UNIVERSITY
- Current Assignee: WAYNE STATE UNIVERSITY
- Current Assignee Address: US MI Detroit
- Agency: Brinks Gilson & Lione
- International Application: PCT/US2013/053019 WO 20130731
- International Announcement: WO2014/022558 WO 20140206
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/76 ; H01L21/3065 ; H05K1/02 ; H01L29/06 ; H01L21/308 ; H01L27/12 ; B81C1/00 ; G01L19/00 ; H01L21/56 ; H05K3/00 ; H01L29/78 ; G01L9/00
Abstract:
A method of making a flexible, foldable, stretchable electronic device. The method includes deposition of a polymer layer, such as parylene C, to impart flexibility to the device. The device overcomes the limitations of related flexible electronics schemes by employing established silicon-on-insulator complementary metal-oxide-semiconductor technology with a flexible enclosure. Devices made in such a way may be used in a wide variety of applications including incorporation into medical devices.
Public/Granted literature
- US20150287607A1 METHOD OF MAKING FLEXIBLE, FOLDABLE, AND STRETCHABLE DEVICES Public/Granted day:2015-10-08
Information query
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