A method and system are provided for a molded electronic package geometry that enables control of warpage and die stress. A mold tool can be closed to define a space or cavity about a semiconductor die disposed on a substrate. Once the mold tool is closed, a mold material can be applied to the space to produce a mold cap. The mold cap geometry can have a first surface that is in contact with the surface of the substrate and a second surface that is opposite the first surface. The second surface can define a tapered portion of the mold cap in which the larger thickness of the tapered portion of the mold cap is in proximity to the semiconductor die and the smaller thickness of the tapered portion of the mold cap is away from the semiconductor die. The thickness of the tapered portion can vary linearly or non-linearly.