公开(公告)号：US09349613B1

公开(公告)日：2016-05-24

申请号：US13614648

申请日：2012-09-13

申请人： Bora Baloglu ,  Jeffrey R. Watson

发明人： Bora Baloglu ,  Jeffrey R. Watson

IPC分类号： H01L21/00 ,  H01L23/34 ,  H01L23/28 ,  H01L23/29 ,  H01L21/56

CPC分类号： H01L21/563 ,  H01L21/565 ,  H01L21/566 ,  H01L23/3121 ,  H01L23/562 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2924/181 ,  H01L2924/1811 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/183 ,  H01L2924/19105 ,  H01L2924/00012

摘要： A method and system are provided for an electronic package with embedded materials in a molded structure to control warpage and stress. A first material can be deposited on a substrate with a semiconductor die. The substrate can be a coreless substrate. The substrate with the semiconductor die can be placed in a mold tool that when closed defines a space about the semiconductor die. A second material, such as an epoxy mold compound, for example, can be applied to the defined space to produce a mold cap in which the first material is at least partially embedded in the second material. The first and second materials can have a different modulus and/or coefficient of thermal expansion. The first material can be used to cover electrical components on a surface of the substrate. In some instances, more than one material can be at least partially embedded in the second material.

摘要翻译： 提供了一种用于具有模制结构中的嵌入材料的电子封装以控制翘曲和应力的方法和系统。 第一材料可以用半导体管芯沉积在衬底上。 衬底可以是无芯衬底。 具有半导体管芯的衬底可以被放置在模具中，当闭合时限定围绕半导体管芯的空间。 例如，可以将第二种材料（例如环氧树脂模塑料）施加到限定的空间上以产生模具盖，其中第一材料至少部分地嵌入第二材料中。 第一和第二材料可以具有不同的模量和/或热膨胀系数。 第一种材料可用于覆盖基底表面上的电气部件。 在一些情况下，多于一种材料可以至少部分地嵌入第二材料中。

公开(公告)号：US08940587B1

公开(公告)日：2015-01-27

申请号：US13546870

申请日：2012-07-11

申请人： Bora Baloglu

发明人： Bora Baloglu

IPC分类号： H01L21/00

CPC分类号： H01L21/56

摘要： Novel die seals control contact of a mold material with the surfaces of a semiconductor die during encapsulation, reducing stresses due to a mismatch of the coefficient of thermal expansion of the encapsulant and the semiconductor die, thereby reducing cracking of the semiconductor die, resulting in increased yields and lower costs.

摘要翻译： 新型模具密封件在封装期间控制模具材料与半导体管芯的表面的接触，减少由于密封剂和半导体管芯的热膨胀系数不匹配引起的应力，从而减少半导体管芯的开裂，导致增加 产量和成本降低。

公开(公告)号：US09269872B1

公开(公告)日：2016-02-23

申请号：US13614631

申请日：2012-09-13

申请人： Bora Baloglu ,  Jeffrey R. Watson

发明人： Bora Baloglu ,  Jeffrey R. Watson

IPC分类号： H01L33/52

CPC分类号： H01L21/565 ,  H01L21/566 ,  H01L23/3121 ,  H01L33/52 ,  H01L2224/73253 ,  H01L2924/181 ,  H01L2924/00012

摘要： A method and system are provided for a molded electronic package geometry that enables control of warpage and die stress. A mold tool can be closed to define a space or cavity about a semiconductor die disposed on a substrate. Once the mold tool is closed, a mold material can be applied to the space to produce a mold cap. The mold cap geometry can have a first surface that is in contact with the surface of the substrate and a second surface that is opposite the first surface. The second surface can define a tapered portion of the mold cap in which the larger thickness of the tapered portion of the mold cap is in proximity to the semiconductor die and the smaller thickness of the tapered portion of the mold cap is away from the semiconductor die. The thickness of the tapered portion can vary linearly or non-linearly.

摘要翻译： 提供了一种用于模制电子封装几何形状的方法和系统，其能够控制翘曲和模具应力。 可以关闭模​​具以限定围绕设置在基板上的半导体管芯的空间或空腔。 一旦模具关闭，可以将模具材料施加到该空间以产生模具盖。 模具盖几何形状可以具有与基板的表面接触的第一表面和与第一表面相对的第二表面。 第二表面可以限定模具帽的锥形部分，其中模具帽的锥形部分的较大厚度靠近半导体管芯，并且模具帽的锥形部分的较小厚度远离半导体管芯 。 锥形部分的厚度可以线性或非线性地变化。

公开(公告)号：US08986806B1

公开(公告)日：2015-03-24

申请号：US13452006

申请日：2012-04-20

申请人： Bora Baloglu ,  Jeff Watson

发明人： Bora Baloglu ,  Jeff Watson

IPC分类号： H01L21/00 ,  H01L23/10 ,  H01L23/00

CPC分类号： H01L23/562 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K2201/09136 ,  H05K2201/2018 ,  H01L2924/00

摘要： A warpage control stiffener ring package includes a substrate having an upper surface and corners. A segmented stiffener ring is formed of “L” shaped segments, each segment being mounted to the upper surface at a corner of the substrate, wherein a gap exists between each of the segments. By forming the segmented stiffener ring of segments having gaps therebetween, warpage of the segmented stiffener ring itself, and thus the thermal stress applied by the segmented stiffener ring on to the substrate, is reduced as compared to a continuous stiffener ring. This allows the segmented stiffener ring to be designed to minimize warpage of the warpage control stiffener ring package.

摘要翻译： 翘曲控制加强环包装件包括具有上表面和拐角的基板。 分段的加强环由“L”形的段形成，每个段被安装到衬底的角部的上表面，其中在每个段之间存在间隙。 通过形成具有间隙的节段的分段加强环，与连续的加强环相比，分段加强环自身的翘曲以及因此由分段的加强环施加到基底上的热应力减小。 这允许分段加强环被设计成使翘曲控制加强环包装的翘曲最小化。