Invention Grant
- Patent Title: Camera module including conductive layer corresponding to shape of electronic circuit pattern layer
- Patent Title (中): 相机模块包括对应于电子电路图案层形状的导电层
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Application No.: US14118472Application Date: 2012-05-17
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Publication No.: US09270873B2Publication Date: 2016-02-23
- Inventor: Kwangjoon Han
- Applicant: Kwangjoon Han
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2011-0046966 20110518; KR10-2011-0069335 20110713; KR10-2012-0051778 20120516
- International Application: PCT/KR2012/003914 WO 20120517
- International Announcement: WO2012/157985 WO 20121122
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H04N5/228 ; H05K1/18 ; H05K1/14

Abstract:
The present invention relates to a camera module, the camera module including a PCB (Printed Circuit Board) formed with an image sensor, a holder formed at an upper surface of the PCB and mounted therein with at least one or more lenses, an actuator positioned at the holder, and an electronic circuit pattern layer formed on the holder.
Public/Granted literature
- US20140092296A1 CAMERA MODULE Public/Granted day:2014-04-03
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