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公开(公告)号：US08651755B2
公开(公告)日：2014-02-18
申请号：US13819652
申请日：2011-06-28
Applicant: Kwangjoon Han
Inventor： Kwangjoon Han
IPC: G03B9/08
CPC classification number: G03B9/10 , H04N5/2253
Abstract: The present invention relates to a camera module including: a shutter including a blocking unit for blocking progress of light, a fixing unit for preventing arbitrary motion of the blocking unit, and a magnet for rotating the blocking unit; a pair of electromagnets mounted about the magnet to rotate the magnet in response to changes in magnetic polarity; and a cylindrical fixing pole for providing an axis for rotating the magnet, wherein the magnet comprises a hole, the hole for inserting the fixing pole being formed through a portion adjacent to a center of the magnet.
Abstract translation: 本发明涉及一种摄像机模块，包括：遮挡器，其包括用于阻挡光的进行的阻挡单元，用于防止阻挡单元的任意运动的固定单元和用于旋转阻挡单元的磁体; 围绕磁体安装的一对电磁体，以响应于磁极性的变化来旋转磁体; 以及用于提供用于旋转磁体的轴线的圆柱形固定极，其中所述磁体包括孔，用于插入固定极的孔通过邻近磁体的中心的部分形成。
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Patent Agency Ranking
2.发明授权Ceramic board, method manufacturing thereof, image sensor package and method of manufacturing the same 有权陶瓷板，其制造方法，图像传感器封装及其制造方法公开(公告)号：US09337114B2
公开(公告)日：2016-05-10
申请号：US13167401
申请日：2011-06-23
Applicant: Kwangjoon Han , Jaechun Lee
Inventor： Kwangjoon Han , Jaechun Lee
CPC classification number: H01L23/13 , H01L23/15 , H01L23/562 , H01L2224/16225 , H01L2924/09701 , Y10T29/49124
Abstract: Disclosed herein is a ceramic board and the manufacturing method and an image sensor package and a manufacturing method thereof, the ceramic board including a ceramic body in which an upper surface is formed with a first groove, a second groove is formed in the first groove, and the second groove is formed with a through hole; a first electrode pad formed in the first groove; and a second electrode pad formed at any one of the upper surface, a lower surface and the both surfaces of the ceramic body, electrically connected to the first electrode pad.
Abstract translation: 本发明公开了一种陶瓷板及其制造方法和图像传感器封装及其制造方法，所述陶瓷基板包括：陶瓷体，其上表面形成有第一槽，第二槽形成在所述第一槽中， 并且所述第二槽形成有通孔; 形成在所述第一槽中的第一电极焊盘; 以及形成在陶瓷体的上表面，下表面和两表面中的任一个处的第二电极焊盘，电连接到第一电极焊盘。
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公开(公告)号：US20130156414A1
公开(公告)日：2013-06-20
申请号：US13819652
申请日：2011-06-28
Applicant: Kwangjoon Han
Inventor： Kwangjoon Han
IPC: G03B9/10
CPC classification number: G03B9/10 , H04N5/2253
Abstract: The present invention relates to a camera module including: a shutter including a blocking unit for blocking progress of light, a fixing unit for preventing arbitrary motion of the blocking unit, and a magnet for rotating the blocking unit; a pair of electromagnets mounted about the magnet to rotate the magnet in response to changes in magnetic polarity; and a cylindrical fixing pole for providing an axis for rotating the magnet, wherein the magnet comprises a hole, the hole for inserting the fixing pole being formed through a portion adjacent to a center of the magnet.
Abstract translation: 本发明涉及一种摄像机模块，包括：遮挡器，其包括用于阻挡光的进行的阻挡单元，用于防止阻挡单元的任意运动的固定单元和用于旋转阻挡单元的磁体; 围绕磁体安装的一对电磁体，以响应于磁极性的变化来旋转磁体; 以及用于提供用于旋转磁体的轴线的圆柱形固定极，其中所述磁体包括孔，用于插入固定极的孔通过邻近磁体的中心的部分形成。
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4.发明申请CERAMIC BOARD, METHOD MANUFACTURING THEREOF, IMAGE SENSOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权陶瓷板及其制造方法，图像传感器包装及其制造方法公开(公告)号：US20110317392A1
公开(公告)日：2011-12-29
申请号：US13167401
申请日：2011-06-23
Applicant: Kwangjoon Han , Jaechun Lee
Inventor： Kwangjoon Han , Jaechun Lee
CPC classification number: H01L23/13 , H01L23/15 , H01L23/562 , H01L2224/16225 , H01L2924/09701 , Y10T29/49124
Abstract: Disclosed herein is a ceramic board and the manufacturing method and an image sensor package and a manufacturing method thereof, the ceramic board including a ceramic body in which an upper surface is formed with a first groove, a second groove is formed in the first groove, and the second groove is formed with a through hole; a first electrode pad formed in the first groove; and a second electrode pad formed at any one of the upper surface, a lower surface and the both surfaces of the ceramic body, electrically connected to the first electrode pad.
Abstract translation: 本发明公开了一种陶瓷板及其制造方法和图像传感器封装及其制造方法，所述陶瓷基板包括：陶瓷体，其上表面形成有第一槽，第二槽形成在所述第一槽中， 并且所述第二槽形成有通孔; 形成在所述第一槽中的第一电极焊盘; 以及形成在陶瓷体的上表面，下表面和两表面中的任一个处的第二电极焊盘，电连接到第一电极焊盘。
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5.发明授权Camera module including conductive layer corresponding to shape of electronic circuit pattern layer 有权相机模块包括对应于电子电路图案层形状的导电层公开(公告)号：US09270873B2
公开(公告)日：2016-02-23
申请号：US14118472
申请日：2012-05-17
Applicant: Kwangjoon Han
Inventor： Kwangjoon Han
CPC classification number: H04N5/2253 , H04N5/2257 , H05K1/141 , H05K1/181 , H05K2201/049 , H05K2201/10151 , Y02P70/611
Abstract: The present invention relates to a camera module, the camera module including a PCB (Printed Circuit Board) formed with an image sensor, a holder formed at an upper surface of the PCB and mounted therein with at least one or more lenses, an actuator positioned at the holder, and an electronic circuit pattern layer formed on the holder.
Abstract translation: 本发明涉及一种相机模块，该相机模块包括形成有图像传感器的PCB（印刷电路板），形成在PCB的上表面处并在其中安装有至少一个或多个透镜的保持器，致动器定位 以及形成在保持器上的电子电路图案层。
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公开(公告)号：US20140092296A1
公开(公告)日：2014-04-03
申请号：US14118472
申请日：2012-05-17
Applicant: Kwangjoon Han
Inventor： Kwangjoon Han
IPC: H04N5/225
CPC classification number: H04N5/2253 , H04N5/2257 , H05K1/141 , H05K1/181 , H05K2201/049 , H05K2201/10151 , Y02P70/611
Abstract: The present invention relates to a camera module, the camera module including a PCB (Printed Circuit Board) formed with an image sensor, a holder formed at an upper surface of the PCB and mounted therein with at least one or more lenses, an actuator positioned at the holder, and an electronic circuit pattern layer formed on the holder.
Abstract translation: 本发明涉及一种相机模块，该相机模块包括形成有图像传感器的PCB（印刷电路板），形成在PCB的上表面处并在其中安装有至少一个或多个透镜的保持器，致动器定位 以及形成在保持器上的电子电路图案层。
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